Used DATACON / BESI 2200 Evo #293615152 for sale

DATACON / BESI 2200 Evo is a fully automated, die attach equipment designed for medium to high volume production in the semiconductor industry. It is designed to provide production yields in excess of 99.9% with an average attach time of 10 seconds per die. The system comes with an intuitive user interface and advanced diagnostic software, which help in monitoring, maintaining, and troubleshooting any operational issues. The unit is composed of four main components: die pick and place head, die attach module, taping head, and vision inspection sensor. The pick and place head is designed to precisely pick up and place die in positive trajectory with high accuracy and repeatability. The die attach module is used to apply die bond onto the die's contact pads in a vapor phase reflow process with surface-mount technology (SMT) solders. The taping head is used to apply thermal release tape for protection of the dies. Finally, the vision inspection sensor serves to verify the image quality, size, and orientation of the die within the die attach board. The machine features a modular concept designed for ease of use and greater adaptability to any environment. It is designed to automate the die attach process with minimal manual intervention. It features a high-speed processor and a low-noise fan-less design. Additionally, it is equipped with several safety features such as over-current protection, short-circuit protection, and temperature monitoring, ensuring enhanced reliability and robustness. BESI 2200 Evo is a comprehensive and reliable automated die attach tool ideal for use in a variety of applications. Its intuitive operation and advanced diagnostics make it an ideal choice for medium to high-volume production. Its modular design and flexible programming ensure maximum output and time savings while providing a range of functionalities in a reliable and efficient asset.