Used DATACON / BESI 2200 Evo #9115929 for sale
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ID: 9115929
Wafer Size: 8"
Vintage: 2008
Die attacher, 8"
In-line SMEMA configuration
Hard disk upgraded to SSD
Spare parts included
Equipment module:
Dynamic XYZ theta servo motors: yes
Theta axis rotary bond-head: yes
Programmable lighting systems with RGB light: yes
Datacon pattern recognition system with edge, pattern, and ink-dot recognition:
Programmable
IPU
CMOS Substrate camera/optics/illumination: Yes
Upward looking camera: Yes
Downward looking camera: Yes
Wafer camera: Yes
Programmable bond force (up to 7000 grams): Yes
Bond force sensor and mini-BMC kit: Yes
Ionizer:
Main axis: Yes
Substrate transport system:
Current transport system configuration:
Heated stage of up to 150 DC temperature
Flatboat configuration
BETS (Belt Elevation TS)
Belt classic transport system:
BETS
Component presentation system:
Wafer lifter and changer: Yes
Wafer table with stretcher: Yes
Additional frame down-holding application for 8" and 12" wafer:
Adaptor for 8"
Wafer frame adapter for automatic change: Yes
Wafer ring adapter for automatic change: Hoop ring adaptor
Waffle pack (Gel pack) holder 2":
Waffle pack adaptor
Separate gel-pack adaptor
Waffle pack (Gel pack) holder 4":
Waffle pack adaptor
Separate gel-pack adaptor
Tape and reel presentation: No
SEMS / GEMS Compliant: Capable but not activated
Input / Output system:
Magazine handler:
SMEMA Ready
I/O equipment: No
Die handling system:
Automatic tool changer unit 7-slot: Yes
Tool holders and tools:
Standard tool holder (shank and tip): Yes
Ejector system:
Single-chip ejector unit: Yes
Upgrade to multi-chip ejection carousel: Yes
Eject tool base: Yes
Needle kit: No
Epoxy application system:
Dispenser-pressure/time:
Time / Pressure
Volumetric pump
Epoxy stamping system:
Time / Pressure
Volumetric pump
Auger or positive displacement:
Configured based on solar product
Flip chip station
Automatic tool changer:
(7) Slots
Die attach
Flip chip capability
ID Axis
Jetter system: Yes
Built-in vacuum pump: Disconnected, but available
Heated stage (150°C): Yes
Vision system with up and down looking cameras
Placement accuracy: 10 µm (3 sigma)
Programmable bond force (7000 grams)
Die pick from wafer, waffle pack, gel pack - Wafer up to 12” with 8" adapter
Waffle pack / Gel-Pak® 2” x 2” and 4” x 4”
Substrate working range: 8"
ID Integrated dispenser for classic transport system
Dispenser volumetric screw pump (ID Axis)
P-Part for automatic transport system (for ID axis)
Calibration tool kit: No
208V/220V Power compatibility: 3Phase - 400V
Machine software installation disk: No
Integrated dispenser
Vision alignment
Pick & place head
X / Y Placement accuracy: ± 7 μm @ 3s
Theta placement accuracy: ± 0.15° @ 3s
Die attach: Disconnected
Heated bond head and plate
Standard bond head: 0° - 360° Rotation
Equipment operating and maintenance manual or CD-ROM: Yes
CE Marked
Currently crated
2008 vintage.
DATACON / BESI 2200 Evo is a die attacher designed to offer precision placement of parts during the manufacturing process. This equipment uses an advanced laser-guided vision system and several servomotor-driven motors to accurately place each part. Its high throughput and velocity make it capable of quickly assembling large numbers of parts while maintaining the highest quality. BESI 2200 Evo is an automated die attacher designed to handle all types of components, including bare dies, MEMs devices, flip chips, and various other products in various package types. The unit is composed of several major components, including control unit, motion machine, mechanical pick-and-place unit, vision tool, and pick up systems. The control asset is responsible for controlling the motors and other actuators and also offers communication with a host computer. The motion model is composed of two servo motors that allow for fine movement and accuracy. The mechanical pick-and-place provides great precision via the precision of five motor axes. The card-picker mechanism ensures accurate placement of components from standard 13" full grids to individual components. The vision equipment uses a machine vision camera to detect the presence of components, determine positions, and perform precision alignment. Lastly, the pick-up system is composed of electromagnets that allow for picking of components with either force fields or vacuum cups. The high throughput of DATACON 2200 Evo is greatly increased by the integrated micro-teaching module. Operators can quickly teach the machine exact paths and location coordinates, utilizing the coordinate unit and teaching rig of the laser-guided vision machine. These paths can then be reproduced within extremely tight tolerances when the machine is given a go signal based on the coordination tool. In order to ensure the highest quality standards, 2200 Evo features multiple sensors that keep track of every step taken in the assembly process. This includes things like temperature and vibration, allowing for complete monitoring of the asset. Quality control systems also check for product consistency upon completion of assembly. Overall, DATACON / BESI 2200 Evo is an effective and efficient die attacher designed to offer the highest level of precision and speed in parts placement. By utilizing advanced laser-guided vision systems and various automation components, BESI 2200 Evo is able to quickly and accurately produce high volumes of parts with the utmost care and consistency.
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