Used DATACON / BESI 2200 Evo #9175392 for sale
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ID: 9175392
Vintage: 2015
Die bonder
LED Placement
Dynamic XYZ theta servo motors
DATACON Pattern recognition system
With edge
Pattern
Ink-dot recognition
Programmable lighting systems with RGB light (partial)
Machine capability 10 µm @ 3s
CMOS Substrate camera/optics/illumination
Upward-looking camera
Wafer camera
Transport system
Bondforce sensor and Mini-BMC kit
Theta axis rotary bond-head
Theta range: 0° - 360°
Resolution: 0.0045°
Teach-in programming
Menu-driven by integrated ETX based
PC and Linux GUI
Documentation: CD-ROM (English)
Options:
(1) DC2018: Static waffle pack holder 2" (6-up)
(1) DC3518: Upgrade to Dual-FOV wafer camera
(1) DC4308: Tool changer unit (7) slots
(1) DC6008: 2200 Evo ID Integrated dispenser
(1) MUINTMM MUSASHI Dispenser integration for main module
(1) DC1188: MUSASHI Dispenser super sigma CMII V2 for ID axis
(1) DC1198: MUSASHI Dispenser super sigma CMII V2 for main axis
(2) MUSSV5: Upgrade MUSASHI super sigma CMII V2 to V5 2
(1) DC7008: Barcode hand scanner
(1) DC7418: Internal vacuum pump
(1) DC7708: Ionizer unit (Main)
(1) DC7918: Connection kit for 2200 Evo
(1) DC8008: SECS/GEM Capability
(Incl. wafer mapping function and wafer scanner)
(1) DC8088: Single component tracking
Accessories:
(1) DC0518: P-Part for automatic transport system (Main axis)
(1) DC6028: P-Part for automatic transport system (For ID axis)
(4) DC4808 :920003200972 Standard tool holders (Without shank and tip)
(2) DC4960: Pick & place or epoxy stamping tools (Off the shelf, no customizing)
(1) DC7948: Calibration tool kit REV.2 (Incl. microscope)
2015 vintage.
DATACON / BESI 2200 Evo is a state-of-the-art die attacher manufactured by BESI, Inc. This advanced equipment integrates sophisticated die handling technology with automated component placement for a streamlined assembly process. BESI 2200 Evo provides a pick-and-place solution for component assembly using an advanced robot control system. The controller features intuitive control functions and can operate multiple die attach heads to increase production throughput. This die attacher is capable of handling integrated circuit packages, including BGA, QFP, and CSP packages. The unit is also compatible with components with leadless or radial leads, as well as EMB, CBN, and PTF soldering systems. DATACON 2200 Evo is equipped with a self-diagnostics function to ensure reliable operation and accuracy. The machine also includes a RTCP (Real-Time Component Placement) feature to ensure accurate positioning of components. Components are accurately located and secured with a high-precision, flat-faced mechanism. The attacher also features an easy-to-use interface, allowing for effortless operation by operators. 2200 Evo is designed for maximum production flexibility and a wide range of applications. Multiple interchangeable substrate handling systems are available to enable the assembly of a variety of components and assemblies. The die attacher is capable of placing complex components onto both printed circuit boards and ceramic substrates. The tool's automated part feeding tray reduces labor costs and increases throughput. DATACON / BESI 2200 Evo combines advanced technology and intuitive design to offer reliable and efficient die attacher solutions. Its robust, integrated design makes it a reliable choice for high-yield, high-speed automated component placement. This asset can be integrated into any existing production line and offers a cost-effective and efficient solution.
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