Used DATACON / BESI 2200 Evo #9176066 for sale
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ID: 9176066
Die bonder
Module 1: DC2208 - 2200 evo
Dynamic XYZ theta servo motors
DATACON Pattern recognition system
With edge, pattern, and ink-dot recognition
Programmable lighting systems with RGB light (partial)
Teach-in programming
Menu-driven by integrated ETX-based industry
PC and Linux GUI
Machine capability: 10 µm @ 3s
CMOS Substrate camera optics illumination
Upward-looking camera
Wafer camera
Transport system
Bondforce sensor and mini-BMC kit
Theta axis rotary bond-head
Theta range: 0° - 360° with 0.0045° resolution
Component presentation system:
DC2008: Wafer table w/o stretcher
DC2308: Wafer lift incl wafer changer
Die handling system:
DC4008: Flip chip station
DC1372: Flip chip tool
DC4308: Automatic tool changer unit: (7) Slots
Tool holders and tools:
DC4808: Standard tool holder
DC4960: Pick and place
Epoxy stamping tools
Ejection system:
DC5008: Single-chip ejector unit
Eject tools:
DCS508: Eject tool base
DC4142: Needle kit
Accessories:
DC7518: Step-up transformer
DC791S: Connection kit (Tubes, fittings, cables)
Software
Includes:
CD-ROM (English)
Currently installed
2013 vintage.
DATACON / BESI 2200 Evo Die Attaching Equipment is a high-performance, automated die-bonder system used for increased throughput and quality in the assembly of microelectronic components. The unit features a uniquely designed workcell which offers precise die-pickup, transfer, and debond operations. With a wide range of options and optimized software, the machine has been developed to reduce bonding cycle times and to ensure accurate and repeatable die placement. BESI 2200 Evo Die Attaching Tool is equipped with a vision asset which can handle various types of component sizes and shapes. With built-in advanced image processing and pattern recognition technology, the model can accurately position and align the component with the component's bond pad. This ensures precise die-pickup and incredibly repeatable die-placement. The equipment also allows for the use of manual and semi-automatic setup which simplifies component changeovers. The system has been designed to reduce component handling time and provide fast, easy setup of the component. DATACON 2200 Evo Die Attaching Unit comes with a wide range of die adhesives that are designed to withstand a range of temperature and environment extremes. The adhesives are compatible with both the component's bond pad and substrate. This provides the machine with flexibility in application areas and allows the die bonder to be used in a wide variety of environments. The tool is equipped with automated adhesive dispense technologies which ensure precise and repeatable amounts of adhesive are dispensed each cycle. The asset is controlled by an easy-to-use graphical user interface and the model provides real-time monitoring of the die-attach process. The equipment also comes with a range of die-attach process parameters that can be easily adjusted and optimized to meet any design requirement. 2200 Evo Die Attaching System is an ideal unit for a wide range of microelectronics assembly applications. With a wide range of options available, users can tailor the machine to give them the exact performance, capability, and flexibility they need for their application.
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