Used DATACON / BESI 2200 Evo #9195858 for sale

DATACON / BESI 2200 Evo is an advanced die attacher that provides an efficient automated solution for flip chip assembly. This machine is capable of precisely placing and bonding bare die to any surface with high-speed accuracy and repeatability. BESI 2200 Evo features an optimized vision alignment equipment, which ensures accurate placement of dies. This is achieved by means of a 5-camera overlay vision system and an advanced proprietary software, combined with either a rotary motion actuator or a linear motion belt. The combination of the vision unit and motion actuator enables the machine to pick up and precisely place and bond the die accurately, with a high repeatability rate. DATACON 2200 Evo is capable of flip chip placement at high speeds of up to 1,800 parts/hour. The machine has four different heads to perform diverse tasks: one head for cooling, one for heating and two for die attach, achieving a bond force of up to 40N. For maximum flexibility and speed, the machine can switch between heads quickly and with ease. The user interface is simple and easy to use, with a touch screen that allows the user to manipulate information, view real-time data, and monitor the machine parameters. The menu navigation is straightforward, making it simple to program the machine and set up different parameters. In addition, the attacher provides an integrated package traceability machine, with optical code readers and an optional barcode scanner. This further enhances part traceability capabilities, ensuring that every item processed is correctly recorded and tracked. This top-of-the-line machine is an efficient die attacher for tough environments and high precision requirements. The optimized vision tool, high speed accuracy and repeatability, integrated package tracing asset, and user-friendly interface makes 2200 Evo die attacher a reliable and cost-effective choice for high-speed assembly production.