Used DATACON / BESI 2200 Evo #9196032 for sale

DATACON / BESI 2200 Evo die attacher is a precision bonding machine developed for the semiconductor industry. This machine allows for the assembling of semiconductor dies to substrates or for stacking of dies in packages. It features a superior bonding accuracy with a repeatability of up to 1µm and allows for a range of bond strengths. It has an optional vision system, with a variable speed and shutter, offering high-quality inspection capabilities. BESI 2200 Evo has an invertible rotary motion, allowing for the pick-up and transfer of die directly from wafer carriers or from individual die transporting devices. It has six degrees of freedom for the positioning of the die onto the substrate, allowing for consistent accuracy and repeatability. DATACON 2200 Evo also features reliable handling for fragile dies, optimized for a wide range of die sizes. This machine features a modular design and includes a range of individual process modules for die preparation, placement, and die bond. It uses a range of bonding techniques, including the solidification of liquid metal alloys, the application of conductive epoxy, and the use of metal-filled paste. The customizable bonding process ensures consistent bond quality and can be customized to accommodate a wide range of products as well as a variety of package types. 2200 Evo can also be paired with an advanced reflow oven to increase the accuracy of the bond and extend the shelf life of the bonded die. The system controls the oven and maintains a stable temperature during the process, resulting in a perfect bond. It is also equipped with an optical inspection system that captures images at high speed to check the quality of the bond. The machine is equipped with multiple settings and options, offering flexibility in terms of size, design, and configuration. It is capable of running a variety of jobs, with production rates up to 5,000 die per hour. It is compatible with standard devices, including lasers and vision systems, making it a perfect choice for specialized production requirements. DATACON / BESI 2200 Evo also provides an intuitive user interface, allowing for quick setup with minimal operator training. In summary, BESI 2200 Evo die attacher is a highly efficient, reliable, and versatile machine for the semiconductor industry. It has excellent accuracy and repeatability, is simple to operate, and offers a wide range of bonding options. This machine offers a great balance of features and performance, making it an ideal choice for modern semiconductor production needs.