Used DATACON / BESI 2200 Evo #9212594 for sale

DATACON / BESI 2200 Evo die bonder is a versatile, high-performance die bonder that offers precision and speed. The equipment features a bonding area of up to 200x200 mm and can handle packages up to 8 mm thick. With its integrated vision system, the die bonder allows for precise placement of components and accurate die underfill. The bonder comes equipped with a range of expandable options, such as z-axis, X-Y-Z access, heaters and liquid dispensing capabilities, CO2 laser welding, marking and coding for automated processes, and remote control for online job monitoring. In addition, BESI 2200 Evo has an automated tape feeder module for up to three different sizes of tape reels. The bonder's advanced control unit is intuitive and allows users to easily customize cycles, including automatic thermal profiling and flux monitoring. An advanced ESD protection machine is integrated into the design to ensure safety and reliability. The tool is equipped with an integrated homing device that allows for quick setup and adjustment. It is compact, ergonomically designed, and highly automated to minimize operator fatigue. With its efficient laser flux asset and high-accuracy die bonding capability, DATACON 2200 Evo is a reliable and powerful die bonder.