Used DATACON / BESI 2200 Evo #9233820 for sale

DATACON / BESI 2200 Evo is a die attacher - a highly sophisticated machine that automates the process of attaching packages to printed circuit boards. This machine has been developed to provide manufacturers with a cost-efficient and reliable method for production of advanced electronic components. BESI 2200 Evo is a fully automatic die attacher machine with a four-axis option. It is capable of quickly and accurately placing a large variety of components onto a single substrate. Its four-axis operation permits it to accurately position and deposit die onto any type of substrate, including ceramic, tape and film, leadframe, and flexible substrates. DATACON 2200 Evo also features a powerful vision inspection equipment which can detect and accurately align the die to the substrate. The machine is equipped with a high-pressure electric-spindle system, which allows it to obtain a high-precision placement accuracy, as well as the capability to achieve very high speed. This spindle unit has a wide range of selectable speeds, giving it greater flexibility for specific applications. The machine also features an array of high-frequency pulse parameters, allowing it to deal with a variety of packages, from small ICs to large ICs. 2200 Evo's visual inspection tool is designed to ensure that all die placement is correct and that the package is correctly affiliated to the substrate. It has several camera systems built-in, which ensure that all parts are accurately aligned and placed. Furthermore, its software allows for user-defined vision recognition and control, enabling it to easily identify and work with various packages without additional time devoted to coding. DATACON / BESI 2200 Evo utilizes state-of-the-art components to provide an optimal solution for the most demanding die-attach processes. Its automated systems enable it to operate at higher speeds than traditional processes, while still providing exceptional placement accuracy. This makes it an ideal die-attach solution for both short and long production runs. In conclusion, BESI 2200 Evo is a revolution in die-attach technologies. It offers a highly efficient and automated solution for attaching die packages to any substrate, with great accuracy and high throughput speeds. Its features and components make it an ideal choice for high-volume production of advanced electronic components.