Used DATACON / BESI 2200 Evo #9291951 for sale

DATACON / BESI 2200 Evo is a high-performance die attacher developed by the leading provider of LEDs and bonding systems, BESI Technology. The machine enables automated placement of a wide range of surface-mount device (SMD) packages in the assembly of complex semiconductor packages such as Multi Chip Module (MCM), Flip Chip, System in Package (SiP), and Fan Out Panel Level (FOPL). BESI 2200 Evo features a novel pinch-drive design that efficiently handles a wide range of die over a broad range of sizes. The machine comes with a bonding head mounted on a 3-axis stage that is capable of positioning and affixing dies up to 3mm thick. Additionally, the machine is capable of placement accuracy of up to 4-microns and repeatability of up to 2-microns, making it ideal for reliable placement of ultra-fine-pitch components. DATACON 2200 Evo is powered by an advanced image recognition system that can automatically adjust the tooling to provide an optimal bond. Additionally, the fully automated machine is capable of setting up to 120 dies per minute and can achieve a maximum speed of 890 mm/s. The machine has several safety features that ensure the highest standards of safety and accuracy. These include vision-based diefinders that ensure the correct placement of dies, and a proprietary vision system that provide feedback to ensure optimal die placement even in complex packages. Lastly, 2200 Evo is constructed from high-grade aluminum and designed to offer superior performance and durability over extended periods of use. Its intuitive design allows operators to quickly adjust, customize, and optimize their process with minimal training. In conclusion, DATACON / BESI 2200 Evo is a precise, high-performance die attacher suitable for a wide range of packaging requirements. Its automated processes, safety features, and intuitive design make it an excellent choice for companies looking to streamline their manufacturing processes.