Used DATACON / BESI 2200 Evo #9316015 for sale

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ID: 9316015
Multi-chip die bonder With high accuracy and high productivity Dynamic XYZ theta servo motors Pattern recognition system With edge, pattern, ink-dot recognition Programmable lighting systems with RGB light Capability: 10 µm at 3s CMOS Substrate camera / Optics / Illumination Camera Wafer camera Transport system Bond force sensor and Mini-BMC kit CD-ROM Theta axis rotary bond head Theta range: 0°-360° Resolution: 0.0045° Options: DC1278 / Input buffer DC1528 / Output buffer DC2008 / Wafer table without stretcher DC2308 / Wafer lift include wafer changer DC4308 / Automatic tool changer unit, (7) slots, 7-nozzle position DC6008 / Integrated dispenser for classic transportation system DC1188 / MUSASHI Dispenser super sigma CMII for ID-Axis DC5008 / Single chip ejector unit DC5108 / Upgrade to multi-chip ejection carousel DC7708 / Ionizer (Main axis) ion fan DC7918 / Connection kit (Tubes, fittings, cables) DC7948 / Calibration kit DC8008 / SECS / GEM Capability communication protocol - / Stamping squeegee unit (Main slider behind) - / IPT Unit (Main slider front).
DATACON / BESI 2200 Evo die attacher is an advanced and versatile machine used for attaching dies to circuit boards in the electrical engineering industry. This type of die attaching machine was developed as an improvement on past methods. It is used to embed a wafer or die onto a substrate using a mix of localized heat and pressure. It is this combination of heat and pressure that allows for reliable and accurate die attachment. BESI 2200 Evo has a modular design, allowing for its customization and versatility. The platform is constructed with a vacuum-manipulated pallet system that can be tailored to specific attachment processes. This allows the machine to quickly and safely place dies and components onto boards with precise accuracy. It also enables the user to quickly change between different die and wafer sizes, allowing for a wide range of applications. The technical components of the attacher are designed for ease of use and maintenance. The heated head is thermally-integrated into the housing for quick warm-up and cool down times. The temperature can also be closely monitored and controlled. Additionally, the joystick controls and LED readouts allow users to quickly manipulate the platform and accurately monitor the process. This ensures a reliable and safe die-attaching process. Furthermore, DATACON 2200 Evo has both pneumatic and electrical implementation options. Its modern design includes capabilities for both pre- and post-fire feedback control systems. These systems allow for instantaneous adjustments to yield a highly accurate and reliable attachment process. The pneumatic system controls the air pressure and volume of the attachment, while the electrical system encompasses components such as the feeder, encoder, and the die head. Finally, the attacher has its own software that is designed to help the user customize and modify the attachment process to their needs. The software allows them to program the machine's positioning and firing parameters. It offers a robust user interface and comprehensive trouble-shooting capabilities. The software is also capable of creating detailed machine logs that provide a comprehensive record of the attacher's operation and performance. Overall, 2200 Evo is a highly advanced and versatile die attacher that allows electrical engineers to quickly and reliably attach dies to circuit boards. Its modular design, thermal-integrated head, customizable software and feedback control systems make it a superior choice for the electrical engineering industry.
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