Used DATACON / BESI 2200 Evo #9359213 for sale

DATACON / BESI 2200 Evo die attacher is a world-class die attaching solution designed to provide superior results across both high and low volume applications. This smart and reliable machine can handle various types of die, including RFID, LGA, BGA and ChipScale devices. Manufactured using advanced 3D design software and quality-tested global standards, this die attacher guarantees high speeds and precise accuracy. The high precision of BESI 2200 Evo die attacher is due to its selective placement solutions, which are built to locate and track die with accuracy to the micron level. The die attacher tracks the mounting position of the die, adjusts for misalignment and recognition of the die, and places it accurately in the template cavity. The machine features a unique Multi-jetver Technology, which ensures accurate positioning of the die and improved heat transfer for efficient and reliable assembly. The die attacher's superior performance is further enhanced by its intuitive human-machine interface (HMI), which provides users with a full range of options and settings to easily and effectively modify the parameters to make sure the die placement is correct. The HMI is also designed to make changeovers between die designs quick and easy. DATACON 2200 Evo die attacher is built with sustainability and efficiency at its core. The machine is constructed with a minimal number of moving parts, and its components are designed to require minimal maintenance. This helps to reduce operational costs and lower the total cost of ownership. In addition, its modular design enhances maintenance and replacement of components with minimum downtime. 2200 Evo die attacher is an excellent choice for a wide range of high and low volume die placement applications. With its combination of advanced technologies and dependable performance, it is the ideal machine for improving the efficiency of production and quality of assembly.