Used DATACON / BESI 2200 Evo #9375977 for sale

DATACON / BESI 2200 Evo is a state of the art enterprise-level die attach equipment that is designed to meet the most demanding needs of advanced semiconductor packaging industry. It delivers high-speed and quality performance in a cost-effective solution. BESI 2200 Evo is equipped with the latest die attach technology that offer the reliability and precision required in today's advanced IC packaging environment. DATACON 2200 Evo offers automatic substrate alignment, a unique pattern recognition system, and multiple pick and place capabilities, allowing it to handle die sizes ranging from smallest ultra-fine-pitch CSPs to large digital die, and accurately placing the die with a placement accuracy of <0.5 micron. The unit also has an 8 Pressure Die Attachment Module (PDAM) that includes a focused support machine and a digital wafer map which ensures repeatable and accurate die placement. The tool also features integrated vision systems for quality assurance and inspection. 2200 Evo comes equipped with a powerful BESI information management asset, which offers comprehensive process control, configuration, and remote access capabilities. This model makes it easier to monitor and adjust the die attach process from a central location, thus allowing for faster production times and higher efficiency. The equipment also offers real-time error reporting, ensuring users can quickly identify and correct issues. DATACON / BESI 2200 Evo also features a dependable and robust modular architecture, which allows for easy maintenance and upgrades. It also offers flexible die attach parameters, making it adaptable to various substrates and die sizes. Additionally, the system includes automatic calibration capabilities and a mensurement stand to ensure repeatable and consistent results. The most outstanding feature of BESI 2200 Evo is the automated die attach unit which offers ease of use. It is designed to provide users with a fully automated die attach process that eliminates manual actions. This means that users can move from one process to another quickly and accurately, allowing for higher productivity, lower operational costs, and improved overall performance. Overall, DATACON 2200 Evo is a robust, reliable, and cost-efficient die attach solution that offers optimal performance in an advanced IC packaging environment. With its unique combination of speed, accuracy, and flexibility, 2200 Evo is perfect for those looking for an engineering-grade die attach machine coupled with the latest in information management systems.