Used DATACON / BESI 2200 PPS #9169223 for sale
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ID: 9169223
Vintage: 2001
Flip chip bonder, 8"
Control system: VME Bus / CAN Bus
Operator monitor / Operator interface: Flat screen monitor, 15"
Operating system: Vx Works
Chip thicknesses: 90-150µm thickness
Data storage:
Internal hard
External 3.5" disk drive (Only HD disks with 1.44 MB)
Material infeed:
Chip sizes: 0.2-20 mm (manual adaptation of the ejection kit
of the ejection system is necessary)
Chip thicknesses: > 0.15 mm
Frame sizes: Up to 254 mm (10")
Substrate:
Substrate size (transport system): Max 255 x 203 x 30 mm
Component height (e.g. SMD’s): Max 30 mm
with tool changer up to 10 mm
Substrate transport height (SMEMA 1.2):
940 - 945 mm, resp. 37 - 38"
Max number of bonding points / Single module: 100 per chip type
Max number of single modules / Substrate:
100 with free programming
60,000 per matrix programming
Max number of single substrates / Transport unit (carrier or boat): 300
Tool changer:
Max number of tool holders: 6
Tool change time, approximately: 1.5 sec
Ejection system changer:
Max number of interchangeable tools: 5
Tool change time, approximately: Up to 4.0 s when changing from 1st to 4th tool
Epoxy - Module:
Working range (XYZ): 254 x 200 x 50 mm
Dispenser:
Feed method (standard): Dosing via feed spindle
Feed method (optional): Pressure / time dosing
Cartridge sizes: 5, 10 and 30 ccm (on the auxiliary Z axis only up
to 10 ccm)
Pick / Place Module:
Working range (XYZ): 254 x 200 x 30 mm
Working range with auxiliary Z axis: 200 x 200 x 30 mm
2001 vintage.
DATACON / BESI 2200 PPS, manufactured by BESI, is a die attach equipment designed and built to meet the highest standards of industrial production. It is a compact, single-site system featuring a high-precision, height-adjustable positioning table, an ultra-high-performance vision unit and an advanced die attach process that ensures repeatability and accuracy. The machine is equipped with a servo driven pick and place tool, capable of placing and attaching die onto substrates with high accuracy and repeatability. BESI 2200 PPS is built to deliver superior performance with a maximum throughput of up to 350kHz, and a process repeatability of +/- 10 µm. The asset features an intuitive user interface with a touch-screen design which provides quick and easy access to all necessary features and settings. To increase throughput, the model is equipped with an advanced board-flipping mechanism with lift-off functionality. It also allows for easy loading and unloading of carriers, allowing for quick and easy changeovers. DATACON 2200 PPS is designed to meet the needs of multiple industries, providing reliable die attach performance in high-density applications, such as automotive electronics, medical devices, aerospace electronics, and other industries. The high-accuracy positioning table has a maintenance-free ceramic bearing and a wide range of tooling configurations, allowing the equipment to meet the requirements of different applications and configurations. The system offers industry-leading die attach accuracy and reliability, with a repeatability of +/- 10µm standard and a low mis-pick rate. It also features a highly advanced solder paste stenciling microscope that provides high-resolution, repeatable die-attach performance, with extremely precise and uniform paste application. The unit is equipped with an integrated thermal imaging camera, which provides inspection and monitoring of the die attach process, and real-time temperature mapping of the die attach pads. 2200 PPS offers superior performance and reliability, making it an ideal choice for high-accuracy die attach applications. With its high-precision and fast throughput capabilities, combined with its advanced process control and inspection capabilities, it is an excellent choice for a wide range of industrial, high-volume die attach applications.
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