Used DATACON / BESI CS 1250 #293826873 for sale

DATACON / BESI CS 1250 is an advanced die attacher specially designed for cost efficient and reliable placement of eutectic die attach and ball attach materials. It offers high reliability and accuracy as a die bonder for high speed pick and place and assembly of packages for electronic and optoelectronic components. The features of BESI CS 1250 die bonder include automated calibration, high speed bond placement, high positional accuracy and high throughput. DATACON CS 1250 utilizes a micromanipulator tool which is placed between two stationary parts, the nozzle and the tray. The tool is used to automate the die attach process. The die is placed into the tray with its edge aligned up to the attachment point and the nozzle is then lowered to the tray with its nozzle positioned above the die. An adhesive agent is then dispensed from the nozzle in a circular or oval pattern to form the die attach material. After the material is complete, the nozzle lifts and the next die is placed into the tray. CS 1250 die attacher features an automated calibration system that enables accurate, repeatable and reliable dispense at 3-Dimensional directions. The system ensures precise placement and applicability without the need for manual re-calibration. The dispense is also adjustable along the vertical Z plane for each step of the dispense process. The die bonder is able to dispense a broad range of eutectic die attachment materials, including gold, silver, copper, tin, solder, and epoxy. The throughput is also high, reaching production rates of up to 300 die per hour, while maintaining accurate die placement, superior quality bonds, and long term reliability. It is also capable of handling die sizes as small as 0.4mm and as large as 12mm. For added safety, DATACON / BESI CS 1250 also features an integrated infrared safety curtain which protects its operators by effectively preventing any person from entering its work area. Overall, BESI CS 1250 is a reliable and cost effective die attach system which offers automated calibration, high speed bond placement, high positional accuracy, and high throughput. It is an ideal solution for production of electronic and optoelectronic components.