Used DATACON / BESI DS 11000 #9240933 for sale
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ID: 9240933
Die sorter
Power cord without plug included
Tape frame / Hoop ring
Dicing tape head
With servo amplifier
Input table for wafer, 6"
With motorized rotation and wafer expansion
Furnace:
Double layer steel case
With (2) cooling fans
Low surface temperature
Fibrous alumina liner and insulation
AI2O3 Coating
Wafer:
Table tooling
Stage camera and optics
Frame barcode reader
Cassette elevator and loader
Digital vacuum detection
Product specific tools:
(5) Needles and vacuum anvil assemblies
(5) Pairs of vacuum pickup tool
Adaptive map correlation
Pick & place: 11000 UPH
Placement accuracy: ±37μ @ 3s
Sort up to (37) Bins with single cassette / (148) Bins with multi cassette
Wafers up to input & output, 8"
LED Size: 0.2 mm - 1 mm
Servo Z motors for independant pick and place motion
Digital vacuum detection
Air ionizer mounted over the input table
Vision system for wafer alignment
Die pick
Die placement and inspection
Wafer cassette elevator and loader
Wafer frame barcode reader
Wafer stage camera and optics
Wafer table tooling for one size wafer frame
Output:
Film frame elevator and loader
Table camera and optics
Frame barcode reader
Internet network interface: TCP / IP
Electronic map import
Operating system: Windows XP
With PC controller
Temperature range:
100°C~1100°C (Continuous)
1200°C (<1 Hour)
Heating rate: ≤ 20°C /min
Temperature accuracy: ±1°C
Heating element: FeCrAl Alloy doped by Mo
Heating zone length:
(2) Zones, 8" (200 mm)
Total heating zone length: 16" (400 mm)
Tube accessories:
Fused QUARTZ tube: 1000 mm L
(2) Fibrous ceramic tube blocks
Power: 3 KW (20 A Breaker)
Power supply: AC 208-240 V, Single Phase, 50/60 Hz.
DATACON / BESI DS 11000 is a die attacher that ensures accurate accuracy and repeatability when attaching semiconductor dice to substrates in a variety of forms, including glass, silicon, and flexible circuits. The equipment is designed for delicate process steps and can handle a variety of die sizes, up to 28 mm x 28 mm. The die attach process is carried out with a pick-and-place head and the heat source for bonding the die is provided by an integrated heater plate fitted to the head. The system is optimized for large-scale production processes, with an advanced motion control unit that allows multiple dispensing programs to run simultaneously to ensure fast throughput. The digital amplifier and laminar gap control technology help to ensure precise placement and repeatable results, while the fine-tune and real-time monitoring features allow for a perfect match between die size and application. BESI DS 11000 also features a patented vacuum head that ensures a secure grip of the die along with an integrated laser vision machine to both inspect the die before and after attachment. An integrated surface mapping tool guarantees a flat and uniform die attach, while the force-displacement monitor verifies the process. The asset also features a single-pass vacuum and high-accuracy thermocouple metrology to ensure accurate heating control. DATACON DS 11000 is part of BESI Production Line, together with fully automated die sorters and wafer handlers. The Building Block Technology allows users to easily integrate with multiple equipment modules to reduce setup time and process stress. The user-friendly software interface makes the model easy to use and maintain, and the low maintenance requirements make it extremely cost-effective. DS 11000 is the ideal solution for mass production applications requiring precision and reliability.
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