Used DATACON / BESI DS9100 #293651909 for sale

DATACON / BESI DS 9100 is a die attacher designed to be used in the semiconductor assembly manufacturing process. With an extensive suite of features, it is designed to be highly reliable and is suitable for full automatic, manual, semi-automatic, and custom automation. The machine is equipped with a multi-media color CCD camera, which provides clear and accurate imaging for fine alignment and lettering purposes. In addition, the lens has a long working distance, a short optical path and a high magnification capability, enabling accurate alignment and inspection of small die. The machine's heated build plate ensures the die remains secure during the bonding process and an integrated vibrating hopper offers improved throughput. BESI DS 9100 is designed to be easy to use, with a full-color touch screen. This allows users to access the on-board controls quickly and adjust settings quickly to provide the most accurate bond parameters. The machine also offers a variety of features, including field angle pre-alignment, chip protection, gap adjustment, pressure adjustment, and error-free optimization of bonds on each die. DATACON DS 9100 also has a unique two-stage die supply equipment which allows another die to be attached immediately after the first die is bonded. This reduces the time for die-change and improves the overall throughput of the system. To ensure the highest quality of bonds, DS 9100 has a special bond-checking unit, which provides a continuous feedback loop. This machine monitors the bond process and provides instant feedback on the quality of the bonds and the process conditions, allowing users to make quick adjustments if needed. DATACON / BESI DS 9100 is designed to meet the highest standards of reliability, providing all the processing components in a single package. Manufactured using high-quality materials, it is also designed to be very durable and can withstand rough handling during repeated die bonding processes. Overall, BESI DS 9100 is an ideal die attacher, offering the latest technology, accurate and reliable bonding and ease of use. With its advanced features, it is well-suited for a range of applications, enabling users to get the best results for their die bonding needs.