Used DATACON / BESI M9 PC #293662172 for sale

Manufacturer
DATACON / BESI
Model
M9 PC
ID: 293662172
Flip chip die bonder Heated chuck M9 Robotic pick and place HH506RA Multilogger / Thermometer OCC Gel-Pak vacuum holder Thor labs PR01 rotation stage OCC Gel-Pak holder / Extension arm NEWPORT 423 Low profile stage NEWPORT 90° Angle bracket NEWPORT XY-stage.
BESI M9E PC Die Bonder and Attacher is a computer-controlled, automated precision die attach tool for the die and component assembly process. The M9E PC is designed as a cost-effective solution for production, prototyping and R&D environments. It uses a servo-driven motion system to accurately position and place die and components into the desired location. The M9E PC also provides a wide range of capabilities including thermal die attach, conductive and epoxy adhesive attachment, and surface mount die placement. The M9E PC is designed for enhanced overall performance efficiency and throughput. Its high-speed motion system is capable of 20 cycles per hour, while its modular design allows for rapid component replacement and a short machine setup time. It features direct torque control for fast, stable component placement, and is optimized for both large scale and ultra-fine die attach applications. The M9E PC also boasts a wide temperature range for bonding between 2102 to 3302 °F (1150 - 1800 °C) with resolution to 0.01 °F (0.01 °C). It uses a sophisticated vision system to accurately locate the die, and can attach a variety of die and components. The M9E PC also features precision pneumatically operated fluid dispense valves for the on demand dispensing of epoxies or viscous liquids. The M9E PC is designed for easy operation, with an intuitive 10" color touch screen and Graphical User Interface (GUI). The GUI displays detailed cycle information, making service and setup of the machine simple and efficient. The M9E PC is also configured with Ethernet/TCP connections, allowing remote access and direct communications to customer databases and Enterprise Resource Planning systems. DATACON M9E PC Die Bonder and Attacher is an advanced automated solution for efficient die and component placement. Its high cycle rates, precise motion control, wide temperature range and intuitive user interface make it an ideal tool for production, prototyping and research and development applications.
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