Used ESEC 2007 IC8 #137001 for sale

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ESEC 2007 IC8
Sold
Manufacturer
ESEC
Model
2007 IC8
ID: 137001
Die Bonder, DINP-BH, PD, IQC, DBH, BFU, WMP, MH-BH.
ESEC 2007 IC8 is a die attacher designed to mount and bond dies on leadframes. It is an all-in-one solution for the die attach process, and features a proprietary optical feedback interface which helps track die alignment, as well as a unique adhesive cartridge for precise and efficient dispensing of die attach material. 2007 IC8 die attacher consists of a 4-Axis robotic arm mounted on a heavy-duty base. The arm is driven by brushless DC servo motors and is easily programmable for die placement, as well as being able to rotate the die to facilitate correct alignment. The camera on the robot arm uses an optical feedback loop to ensure accurate alignment of the dies within 0.5mm, while the adhesive dispense is provided by a cartridge-based system which ensures a smooth and uniform die attach process. In addition to the robotic arm, ESEC 2007 IC8 die attacher also features a temperature control station and a 3-axis vision-guided alignment system. The temperature control station allows for precise and uniform heating of the leads before the dies are applied, promoting an effective bond. The 3-axis alignment system is designed to ensure accurate placement of the die even on leadframes with irregular geometries. Finally, 2007 IC8 die attacher has an intuitive human-machine interface, allowing for easy operation and customization. The interface also allows for quick changes to settings and programs, as well as monitoring the performance of the unit. This ensures the accuracy of the attached dies and helps ensure the highest levels of production efficiency. Overall, ESEC 2007 IC8 die attacher is an ideal solution for companies looking to streamline the die attach process while maintaining accuracy and efficiency. Its state-of-the-art capabilities and robust construction makes it a great choice for both low-volume and high-volume production requirements.
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