Used ESEC 2007 IC8 for sale

ESEC 2007 IC8
Manufacturer
ESEC
Model
2007 IC8
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Wafer Size
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ESEC 2007 IC8 #170432

ESEC

2007 IC8

Die bonder, up to 8" Specifications: Max. Chip Size: 25.4 x 25.4mm Wafers: Up To 8" Dia Programmabl
612
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ESEC 2007 IC8 #293761390

ESEC

2007 IC8

Die bonder.
126
ESEC 2007 IC8 #9312388

ESEC

2007 IC8

Die bonders.
291
ESEC 2007 IC8 #9108960

ESEC

2007 IC8

Die attacher.
309
ESEC 2007 IC8 #197318

ESEC

2007 IC8

Die bonder.
265
ESEC 2007 IC8 #177826

ESEC

2007 IC8

Die bonders.
295