Used ESEC 2007 IC8 #9108960 for sale

ESEC 2007 IC8 die attacher is an automated die handling and bonding equipment designed to streamline the process of attaching dies to leadframes. It has a compact and robust design which makes it well suited for a wide variety of applications. The system is equipped with a precision electric drive with an accurate positioning accuracy of 0.2 mm and a rotation accuracy of 0.5 degrees. It can be used with a variety of die sizes ranging from 2.0 to 16.0 mm. The vacuum pick-up unit allows for accurately positioned die placement, as well as exceptionally secure bonding. The die as released is positively held in place via a vacuum hold feature, and the machine also includes an anti-slip feature which removes the potential for dies to slip out of alignment during the bonding process. 2007 IC8 is also equipped with a micro-adjustable pre-tensioner, which allows for easy adjustment of the clamping force to account for different die, leadframe, or bonding material combinations. This built-in adjustability helps provide a more reliable, repetitive process. The tool is capable of addressing varying requirements for multiple bonding processes. For example, the IC8 can bond thermocompression, thermosonic, or epoxy bonding techniques for a variety of die materials or leadframes. This includes VLSI or IC die, as well as flip-chip or BGA leadframes. ESEC 2007 IC8 also has a wide range of other features to make die handling and bonding efficient and reliable. These include a user-friendly die placement systems, and automated die bonder tray feed operation that allows for fast loading and cycle times. The asset also includes advanced diagnostic failure alarms, and a memory capability which makes recall of frequently used processes easier. Overall, 2007 IC8 die attacher provides users with a robust and reliable automated die handling and bonding model which is well suited to a wide range of applications. Its precision electric drive, vacuum pick-up equipment, micro-adjustable pre-tensioner, and wide range of process capabilities make it the die handling and bonding solution of choice for many businesses.