Used ESEC 2007 IC8 #197318 for sale

ESEC 2007 IC8 is a die attacher, a specialized machine designed to facilitate the mounting of semiconductor die to a leadframe or substrate. This machine serves as a key component in the manufacturing process of integrated circuits and other electronic components. 2007 IC8 has two distinct operation modes: dispensing and die mounting. In dispensing mode, the machine operates in two discrete steps. First, the machine creates a precisely positioned solder bead called a "punch". The punch, a 0.015mm to 0.030mm in thickness at a reduction factor of 9-14%, is used to secure the die to its connection pad on the substrate. Second, the machine dispenses the flux to optimize the spread of the solder bead. In die mounting mode, the machine automatically mounts each die in its assigned position on its leadframe. In this process, the leadframe is brought into exact alignment with the die using a vision guided X/Y servo assembly system, and is securely held in that position with a vacuum chuck. The machine is run by a graphical user interface (GUI) that allows the user to customize the process for every job while monitoring the performance of the machine. The GUI also provides control over the process parameters such as die position, mounting pressure, reflow profile, and other parameters. In addition, ESEC 2007 IC8 has dual-vision pick-up capabilities, with two separate cameras mounted on a boom. This allows for operation even on uneven surfaces, allowing for accurate die mounting. Overall, 2007 IC8 is a highly precise and reliable die attacher. With its automated operation, dual-vision pick-up, and the flexibility provided by its graphical user interface, it is ideally suited to increasing production yields while ensuring the highest quality and reliability of electronic components.