Used ESEC 2007 IC8 #9312388 for sale

ESEC 2007 IC8 is a die attacher designed to streamline the process of attaching dies to bond pads. This high-precision, manual die attacher is capable of processing up to eight dies in parallel and offers an extremely cost-effective solution for die attach operations. 2007 IC8 feature a manual loading and unloading system with a mobile base, allowing for easy movement with a manual trolley. ESEC 2007 IC8 is equipped with a pneumatically driven, four-finger dial-type tooling system, which enables precise positioning of the dies in relation to the bond pads. Additionally, variable control parameters can be set to insure consistent results with every operation. This allows for perfect accuracy and repeatability of each die attach operation. The die attacher is easy to operate and features a simple graphic user interface (GUI). The GUI displays up to thirteen parameters (including die size, die position, force and temperature) that can be adjusted and stored prior to each die attach operation. A bundle of up to four bonded dies can be released and 2007 IC8 features a vacuum system for safely removing the attached dies from the bond pads. ESEC 2007 IC8 is designed to work with all popular die types including: J-Lead, Flip Chip, Gull Wing, Ball Grid Array (BGA), and Chip-on-Board (COB) - and offers flexibility in selection of nozzle, pallet, and stencil design. This robust die attacher is capable of handling die sizes ranging from 0.5mm up to 5.0mm with precision and accuracy. Overall, 2007 IC8 offers superior performance, high accuracy and repeatability for die attach operations. It is a cost-effective and user-friendly solution for automated die attach operations and consistently delivers reliable results. With its flexibility to work with a variety of die types, this compact die attacher is ideal for a range of die attach applications.