Used ESEC 2007 IC8 #170432 for sale

Manufacturer
ESEC
Model
2007 IC8
ID: 170432
Wafer Size: Up to 8"
Die bonder, up to 8" Specifications: Max. Chip Size: 25.4 x 25.4mm Wafers: Up To 8" Dia Programmable Dispensor Max. Dispensing Area: 25 x 25mm Die Size Range: 2 x 2mm - 20 x 20mm Top Stack Loader Quality Control Camera Pick & Place System Magazine Holder Programmable Controls Manual Books Mapping function Currently installed 1998 vintage.
ESEC 2007 IC8 is a high-speed die attacher designed for high volume production in the electronics and automotive industries. The machine is capable of attaching both single-sided and double-sided die to various substrates such as ceramic, film, plastic or metal with high accuracy and speed. 2007 IC8 die attacher uses an articulated robot arm equipped with two linear drive XY axes and a single rotary axis to precisely position the delivery head of the die over the substrate automatically. The machine can be programmed to mount die with pitches from 0.255mm to 3.175mm with an overall pickup tolerance of +/- 0.1mm. Once the die has been picked up by the vacuum nozzle, it is accurately placed on the substrate with as little as 0.1mm accuracy. ESEC 2007 IC8 is capable of attaching up to 20,000 die per hour in a continuous production run. The system also incorporates control and diagnostic hardware which allows the machine to reliably monitor die pickup and placement and make corrections to the process if necessary. An integrated vision system is also included which can detect and reject misaligned die prior to pickup. The machine is driven by a high performance CNC controller which makes it simple to setup and maintain. It is also capable of being interfaced with external automation systems and supports a range of programming languages including SAS, PC-linux and PC-windows. The machine is available in Multiple languages including English, Chinese and Spanish and includes detailed user manuals and help files for easy operation. Overall, 2007 IC8 is a highly reliable, accurate and efficient die attacher, suitable for high volume production in the electronics and automotive industries. The machine offers precise pick up and placement of die with minimal operator intervention, as well as comprehensive diagnostic and control hardware for smooth and reliable operation.
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