Used ESEC 2007 IC8 #181170 for sale

ESEC 2007 IC8 is a die attacher specifically designed for the assembly of tape automated bonded (TAB) components. This versatile machine has a unique IntelliHead™ feature which allows for precise die placement, registration and bonding of the die without the need for a tie bar. This eliminates the need for tedious and time-consuming registration alignment processes. 2007 IC8 uses a powerful vision system to detect and align the die to a tightly-controlled accuracy of 0.1 mm, prior to its bonding. This ensures that the die is always connected precisely to its position in the substrate. Furthermore, a robotic arm picks up the die and moves it to the bonding area, where a vacuum head is then used to precisely position the die in place. This advanced die attacher utilizes a high-precision X-Y-Θ bonding head with advanced adjustability to ensure the best process yields and reliable device properties. ESEC 2007 IC8 is equipped with a heating system capable of operating between 20°C-600°C. This helps to ensure the overall process repeatability and maintain uniform process temperatures and thermal cycling profiles. The heated bonding head is also used to localize heating of the die and substrate when required to ensure high-quality bonds. For added accuracy, this machine also features innovative dual-axis alignment with high accuracy slide adjustment and cam backing adjustment to eliminate any mechanical die sliding or slippage. This ensures uniform bonding pressure and repeatable die connections even when using excessively large or off-center components. Furthermore, 2007 IC8 can be equipped with an integrated view system to display the orthogonal alignment of the die prior to bonding. ESEC 2007 IC8 is an ideal solution for the assembly of TAB components. Thanks to its advanced features and precise die presentation and registration process, this machine delivers reliable and consistent results with improved yields. Furthermore, the high-precision X-Y-Θ bonding head allows for precise die connections, ensuring optimal performance and device properties.