Used ESEC 2007 IC8 #58873 for sale

ESEC 2007 IC8 is a die attacher designed and manufactured by ESEC, a leading provider of precision high-speed assembly machines. This fully automated die attaching equipment is capable of supplying, aligning, and bonding high-complexity die to substrates. Designed for high accuracy and efficiency, 2007 IC8 is capable of delivering repeatable, superior performance in smt placement, wire bonding, as well as die placement applications with a high degree of correctness and speed. ESEC 2007 IC8 die attacher is based on a highly advanced motion and vision system. A dynamic X-Y motion table is used for precise loading, aligning, and bonding operations. The built-in vision unit allows for the precise registration of die before each placement. The registration stages consists of several components, including die-to-die alignment, substrate registration, and die-to-substrate alignment. This ensures that each die is placed in its exact location, resulting in repeatable and reliable placement. The machine is designed to reduce cycle times, minimize emissions, and consume less power. To achieve this, ESEC has implemented two pick-and-place speeds: a basic speed for routine operations, and a high-speed mode for operations which may require additional speed and accuracy. This high-speed mode significantly decreases cycle time, reducing production costs. 2007 IC8 is also equipped with a number of safety features and sensors to ensure the safety of personnel and equipment. This includes a shock detection machine which can detect a drop in the force applied to the machine, and an anvil guard which detects a misalignment of the die and substrate. In addition, the machine is equipped with a security tool which is activated whenever the user is not in proximity of the machine. This ensures that unauthorized access is not possible. ESEC 2007 IC8 is a highly efficient and precise die attacher that is designed to meet the needs of the most demanding applications in the industry. Its advanced motion and vision systems and safety measures make it an ideal choice for any die bonding operation.