Used ESEC 2007 IC8 #9396963 for sale

ESEC 2007 IC8 is an automated die attacher designed for the efficient and precise attachment of dies and other components onto a silicon wafer. This die attacher utilizes a vision equipment that allows for accurate alignment and placement of dies onto the wafer. This system is capable of achieving fine placement accuracy with a positioning accuracy of +/- 0.25um, and is suitable for die sizes of up to 4x4mm. 2007 IC8 is specifically aimed at improving yield and throughput of die attach processes, and its highly integrated design allows for an optimally efficient and reliable operation. The machine utilizes an X-Y-Θ stage with precision linear motion slides, which is driven by three closed-loop motor controllers. It also features a microscope imaging unit with a direct drive positioner in order to ensure accuracy and repeatability in die placement. The microscope imaging machine provides a convenient and easy way to inspect parts and if necessary, reattaches them instead of having to manually realign them. The microscope imaging tool also facilitates a variety of device test functions, such as optical character recognition/picture recognition. Aside from its capabilities in die and component attachment, the IC8 is also equipped with a special feature that allows it to perform die attach defect analysis. This feature can detect patterns of chip misalignment or misposition that could lead to potential defects or failure of the device. The automatic die attach defect analysis feature can also help minimize any process downtime due to misaligned dies or components, with an accuracy and speed not attainable with manual inspection. The IC8 also boasts a broad range of automated tooling options, allowing for versatility and flexibility when tackling different die attach tasks. This feature allows for the quick and easy setup of tooling for different die sizes and shapes. It also offers an intuitive and user-friendly interface, simplifying die attach operations and helping to improve the efficiency of the overall die attach process. In conclusion, ESEC 2007 IC8 is a highly advanced and automated die attacher that is capable of delivering high precision, accuracy, and throughput. Its combination of features such as high accuracy die placement, automated optical inspection, and defect analysis make it an ideal choice for die attach processes. Its user-friendly interface and automated tooling options make it convenient and easy to use, helping to ensure an optimal die attach process.