Used ESEC / ZEVATECH CT2000 #166868 for sale

Manufacturer
ESEC / ZEVATECH
Model
CT2000
ID: 166868
Assembly system robot, parts system Specifications: XYZ work cell 23" x 27" x 4" Substrate sized 3"x3" up to 12"x20" Vision-driven accuracy +/-0.002" Speed: 60"/sec X & Y axes, 20"/sec Z axis, 360º/sec theta Resolution: 2 microns X & Y axes, 0.97 mircons Z axis, 0.001º Repeatability: 0.02mm X/Y 0.01mm Z 0.01º Accuracy: 0.038mm X & Y (mapped) Top & Bottom vision system with programmable lighting Geometry recognition and placement offset calculation capability Bottom edge belt conveyor.
ESEC / ZEVATECH CT2000 is a high-end die attacher capable of handling a variety of complex applications and is a great choice for automating the assembling of semiconductor and die packages. This die attacher is equipped with a fully autonomous inspection equipment that provides precise quality control for a complete die-attaching process. The system is designed to handle packages up to 4x4mm in size and a variety of complex shapes, from simple to complex, making it well-suited for applications in semiconductor, optical, industrial, and automotive industries. The die attacher features a flexible software interface with programmable vacuum and glue levels, as well as an advanced XY table that can be programmed to pick up, position, and set down a die accurately on the carrier. The patent-pending bonding tape technology of ESEC CT2000 offers exceptional die attachment and connection quality regardless of the size and shape of the die. The bonding tape is designed in order to reduce thermal stress and reduce the total assembly time of the die. The thinness of the tape helps to reduce overall bond height, while its high temperature stability allows the machine to operate consistently with minimal risk of bond failure. The machine is equipped with a powerful yet compact stepper motor, mounted on a support unit to ensure precise alignment along with a dedicated two-axes vision unit for precise die placement and alignment. With the standard attachment space of 4x4mm, ZEVATECH CT2000 can easily bond dies from 0.02mm - 2.5mm in thickness and 200 microns - 1mm in pitch. Equipped with intuitive software, the controller ensures ease of use, with full-colour displays that allow operators to change settings in real-time. Also included in the machine is a set of safety sensors and interlocks which minimize the risk of injury or damage to the surrounding components. In conclusion, CT2000 is a reliable, robust and easy to use die attacher. Sophisticated features and versatile programming options ensure better productivity, quality control, and a reliable attachment of dies from a variety of shapes and sizes. ESEC / ZEVATECH CT2000 is highly recommended for automated die-attaching in multiple industries, ranging from semiconductor to automotive, making it a great choice for those looking for a reliable and efficient Die Attacher.
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