Used RENESAS CM 700 #9157562 for sale

RENESAS CM 700 is a high-precision die attacher that is used for efficient assembly of semiconductor chips in printed circuit boards. The equipment is based on an automation platform that includes a 200-watt optical laser, a programmable laser system, and a precision tweezers unit for handling and placing individual die onto the target surface. RENESAS CM-700's innovative laser machine is capable of accurately positioning die with sub-micron precision, and its advanced tweezers tool is designed to safely pickup, place, and align the die onto the target surface with high accuracy. CM 700 includes sophisticated vision capabilities for precise recognition of die, substrate, and other components in its assembly chamber. Its unique laser-based inspection asset is capable of detecting die misalignment and inspecting for any anomalous die shapes or damaged chips. Additionally, the laser model creates an array of fiducials to further enhance accuracy of component placement of the circuit board assembly process. CM-700 incorporates an efficient two-stage die pick-up process for improved accuracy and speed. The first stage involves the tweezers equipment to accurately pick the individual die from the substrate, and the second stage uses the laser system to accurately place and align the die onto the target surface. The unit includes automatic die detection and identification capabilities, allowing for quick registration of the die. The machine is compatible with multiple substrate material types including ceramic, plastic, and flex. Additionally, various vacuum pickup tips are available to ensure compatibility with a wide variety of die sizes and shapes. The tool also has the capability to store substrate format information for subsequent die placement. RENESAS CM 700 is a powerful die attacher asset designed for reliable, accurate, and efficient assembly of semiconductor components onto circuit boards. It combines advanced optical laser and tweezers technology with automated vision and die recognition capabilities for accurate component placement. It is easy to use and offers a range of features and capabilities that make it ideal for both amateur and professional semiconductor product assemblers.