Used ESEC 8003 for sale

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Manufacturer

ESEC

Model

8003

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Dicing saw, 6" Wafer thickness: 0.01 mm-5.0 mm X-Axis feed: 240 mm Y-Axis index: 165 mm Index ste

118

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Dicing saw.

111

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Dicing Saw X-Travel: 6.5" x 9" High power spindle Motorized theta movement.

100

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Dicing saw.

103