Used AMAT / APPLIED MATERIALS Centura II DPS+ #9212833 for sale
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ID: 9212833
Wafer Size: 8"
Metal etcher, 8"
Loadlock: Wide
Robot: VHP+
Position A: Metal DPS+
Position B: Metal DPS+
Position C: ASP+
Position D: ASP+
Position E: Fast cooldown
Position F: Orienter
Chamber A / B:
Process application: DPS+
Upper chamber body anodizing
Electrostatic chuck type: Polymide
SEIKO SEIKI STPH 1303C Turbo pump
DTCU: E-EDTU
Endpoint type: Monochromator
Bias generator: OEM 12B (-08)
Bias match: 0010-36408
Source generator: ENI GMW-25A, 2500W
Throttle valve & gate valve: VAT TGV
Chamber C / D:
Process kit: Chuck
Auto tuner: Smart match 3750-01106
Magnetron head: 0190-09769
Generator: ASTEX AX2115
Process control: Manometer
Gas box:
VDS Type: 750 SCCM
IHC Module: MKS 649
Transfer chamber options
Transfer chamber manual lid hoist
Robot type: VHP+
Cable: Umbrical
Length: 55 Ft.
APPLIED MATERIALS Centura II DPS+ is an advanced automated semiconductor process reactor developed to provide greater control and precision compared to prior models. This high-speed reactor has been designed to accurately and quickly etch wafers, including nanochanneled circuits and structures, as well as perform rapid sputter deposition and lift-off operations. The reactor is equipped with a digital scanning stage, a well-engineered microprocessor control equipment, and a two-stage gas delivery system that allow for very precise atomized delivery and deposition of thin film products. With a three-region RF-biasing module, Centura II DPS+ is designed to offer users high-end uniformity in etching, sputtering, and deposition operations. This exceptional uniformity allows for significant time and cost savings as well as optimal product specifications. With an integrated chemical delivery and pump unit, APPLIED MATERIALS Centura II DPS+ enables users to accurately control gasconsumption for process optimization. The digital scanning stage of Centura II DPS+ provides a high-speed, automated, and reproducible wafer processing environment, with up-to-date data-integration and product tracking tools. Furthermore, the machine has recently been developed to allow for radial-vector scanning, increasing throughput while improving wafer shape conditions. The microprocessor control tool of APPLIED MATERIALS Centura II DPS+ provides users with a variety of powerful capabilities such as automated temperature control, scan-speed control, program scheduling, as well as command integration. In addition, the asset offers users a variety of customizable features such as adjustable gas concentration levels, process recipe fine-tuning, and efficient cycle time optimization. The highly advanced mechanical design of Centura II DPS+ ensures precise and long-lasting operation as the model offers very low vibrational excitation, as well as low electrical leakage. In addition, the products of this reactor have an extended lifespan thanks to its inert-gas-shielded containment equipment and nitrogen-circuit technology. Thanks to the superior features of APPLIED MATERIALS Centura II DPS+, users of this system can enjoy exceptional precision and accuracy with each run, and optimize their production processes without sacrificing quality or efficiency.
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