Used HITACHI M 308ATE #293799553 for sale
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ID: 293799553
Wafer Size: 8"
Vintage: 1995
Etcher, 8"
Missing parts:
EC Turbo pump
Turbomolecular pump controller
Chamber process kit
Chiller
Pumps
Scrubber
Transfer robot
LL / UL cassette motor
AC gate cylinder
Magnetron generator: EC, AC
SEIKO SEIKI STP-H2000K Turbo pump
Micro PC
1995 vintage.
HITACHI M 308AE is a sophisticated etcher/asher equipment designed for semiconductor and microelectronics manufacturing processes. This advanced tool incorporates state-of-the-art technology to provide precise and reliable processing capabilities for critical applications in the semiconductor industry. The machine is a versatile platform that enables high-performance etching and ashing of various materials with exceptional uniformity and repeatability. At the core of M 308AE is a robust vacuum chamber that ensures a clean and controlled processing environment. This chamber is equipped with multiple gas inlets and plasma sources to facilitate a wide range of etching and ashing chemistries. The system also features advanced RF power supplies and impedance matching networks that deliver high-density plasma discharge for efficient material removal and surface modification. HITACHI M 308AE utilizes a combination of plasma etching and ashing techniques to achieve precise and selective material removal. Plasma etching is a dry etch process that uses reactive ions to chemically etch away material from a substrate surface. This technique enables high-resolution patterning and precise feature control for semiconductor device fabrication. On the other hand, plasma ashing involves the removal of organic materials by oxidizing them in a plasma environment. This process is essential for removing photoresist residues and other contaminants from the substrate surface. The unit is equipped with a sophisticated gas delivery machine that enables precise control of process parameters such as gas flow rates, pressure, and composition. This control allows users to tailor the process conditions to meet specific etching and ashing requirements for different materials and device structures. M 308AE also features advanced endpoint detection capabilities that enable real-time monitoring of the process to ensure accurate control of etch depths and removal rates. HITACHI M 308AE is a highly automated tool with intuitive user interfaces and advanced process control software. The asset is equipped with recipe-driven control capabilities that enable users to define and execute complex process sequences with ease. The software also features real-time data monitoring and logging functions that provide users with detailed information on process parameters and performance metrics. In addition to its advanced processing capabilities, M 308AE is designed with productivity and reliability in mind. The model is equipped with automated wafer handling systems that enable efficient loading and unloading of substrates, reducing cycle times and improving throughput. The equipment also features robust hardware components and built-in diagnostics tools that ensure continuous operation and minimize downtime. Overall, HITACHI M 308AE is a versatile and reliable etcher/asher system that offers precision, efficiency, and flexibility for semiconductor manufacturing applications. With its advanced technology, user-friendly interfaces, and high-throughput capabilities, the unit is ideally suited for demanding production environments where high-performance processing is essential for achieving critical device specifications.
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