Used LAM RESEARCH Rainbow 4520i #9180717 for sale
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ID: 9180717
Wafer Size: 6"
Vintage: 2004
Dry etcher, 6"
Clamped chuck
Verity enhanced endpoint detection
Hines indexers
Matching network: LoFat
ISO Matcher: Yes
Top and bottom RF cables: Standard
Chamber process kit parts:
Pick and place wafer transport with non-wafer contact optical alignment
Inductive RF auto tuning: Fast accurate RF tuning for precise control
Active temperature control of upper and lower electrodes
Vacuum load-locked low pressure oxide system
Parallel plate reactor: Proven etch technology
Variable gap spacing: Wide process flexibility
Integrated isotropic-anisotropic etching
(2) Active chambers
Flat notch orientation
Upper and lower baffles
Electrode clamp ring
Attachment ring
Filler ring lower clamp
Focus ring edge lower
Vespel confinement ring
Bottom wafer clamp
Bell jar
Single wafer
4520i Isotropic etch chamber:
Integrated into entrance load-lock
1250 Watt solid state
Water cooled remote isotropic chamber RF generator
RF Match housing resides at the left side of the isotropic module
(3) MFCs For isotropic chamber
Pressure controller for helium backside wafer cooling
Hinged upper housing of isotropic chamber
Air blower assembly
OEM Specifications / Typical results:
Dry pumps / Chiller not included
Selectivity BPSG/TEOS to poly: >15:1
Thermal oxide etch rate: ≥ 4500A/min
BPSG Etch rate: >7500 A/min
TEOS Etch rate: >5000 A/min
Particles: 0.3μm size
Uniformity: +/- 10% 3
4520 Anisotropic etch chamber:
Single wafer etch: Individual wafer etch
Wafer temperature control:
Reduced loading effects
Profile control with extended over etch
LAM RF Generator rack:
Main RF generator
ISO AE RFG 1250 RF Generator
2004 vintage.
LAM RESEARCH Rainbow 4520i wet etcher/asher is a state-of-the-art plasma etching equipment for a variety of materials including aluminum, copper, silicon, and other hard metals. The system has high repeatability and is designed for high-precision semiconductor applications. With a standard cell, Rainbow 4520i provides uniform, repeatable results throughout the entire etch cycle. The unit features an advanced process control machine, providing real-time control of wafer temperature and pressure, while optimizing etch cycle time and conserving the etchant solution. The tool is equipped with a variable- frequency power source and an advanced electron-cyclotron resonance source (ECR) to obtain uniform, isotropic etching across the wafer surface. The gas and/or vapors are mixed and regulated as required for a particular type of substrate and deposited material. The use of a digital controller allows for precise control of the power levels, temperature, and etch duration. The asset also supports a variety of cooling strategies, providing uniform thermal control of the wafer surface. It includes an advanced impurity control model that helps maintain a high quality etch surface. The impurity control equipment is facilitated by a unique scrubbing system which utilizes a combination of a soft-brush scrubbing and a micro-flux cleaning technique. The unit also includes a range of tools and accessories to meet specific material etching requirements. It is equipped with an array of lift pins and flexible nozzles designed to etch different patterns and sizes. In addition, the machine also supports multiple gases and/or vapors to create various etch surfaces ranging from extremely deep etch to shallow etch. Overall, LAM RESEARCH Rainbow 4520i etching tool is an efficient piece of machinery with various features that provide accurate and repeatable etching results that are second to none. Its advanced features allows it to etch multiple types of materials and its process control asset assists in keeping the etching process uniform and consistent. The flexible nozzles and multiple gases provide a range of etching styles from extremely deep etch to shallow etches. The sophisticated technology of the etching machine makes it one of the best on the market.
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