Used OXFORD Plasmalab 133 #293824951 for sale

ID: 293824951
Vintage: 2013
Reactive Ion Etcher (RIE) Gas holder Control system Chiller Wafer sizes: 2″/3″/4″/5″/6″/8″/12″ Plasma source: 13.56 RF 0-600W Process gases: 7-channel MFC gas Gas lines: Cl2 - 100 sccm BCl3 - 100 sccm CH4 - 50 sccm Ar - 100sccm NH3 - 100 sccm CHF 3 - 200sccm N₂O - 200 sccm 2013 vintage.
OXFORD Plasmalab 133 is an advanced etching and ashing equipment designed to deliver superior surface preparation and processing of electronic components. The system features a powerful, dual-frequency RF power supply that is capable of providing a range of below-atmospheric pressure processing. This allows for the creation of a highly reactive environment that is ideal for atomic mixing, pattering and etching of surfaces. Plasmalab 133 includes a range of advanced features including an integrated gas manifold, gas flow control and adjustable pressure monitoring. The unit also includes a high-precision quartz crystal monitor, as well as a range of powerful diagnostic tools. The high-precision quartz crystal monitor ensures accuracy and enables the user to calibrate and adjust the etch and ashing process for optimal performance. The etching process is performed on the underside of a workpiece in a vacuum chamber. The bottom of the chamber is heated to the required temperature with a heating element and the controlled environment enables a precise etching process. The mechanism for controlling the process is based upon a combination of DC, AC and pulsed power, as well as various other parameters such as voltage, current and pressure. By creating a highly reactive environment in the chamber, OXFORD Plasmalab 133 is capable of producing excellent results with minimal contamination. The etching process is monitored and controlled by a computerized machine, ensuring accuracy and precision. The integrated gas manifold allows the user to select the appropriate gas mixture depending on the application. Plasmalab 133 includes a range of safety features to protect the user, such as an active barrier shield, RF and pressure protection, and protective wear. The tool is also equipped with an emergency venting asset to protect the user from potential contamination. The model has a simple user interface for easy operation, providing intuitive controls and a range of graphical displays for easy viewing. In conclusion, OXFORD Plasmalab 133 is an advanced etching and ashing equipment designed to provide superior surface preparation and processing of electronic components. The system is equipped with powerful, dual-frequency RF power supply, an integrated gas manifold, a high-precision quartz crystal monitor, and a range of safety features for enhanced protection. The simple user interface and intuitive controls, combined with the range of advanced features and performance, make Plasmalab 133 an ideal choice for any application.
There are no reviews yet