Used OXFORD Plasmalab 133 #293824962 for sale
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ID: 293824962
Wafer Size: 2"-12"
Vintage: 2013
Reactive Ion Etcher (RIE). 2"-12"
Power: 600 W, 13.56 MHz RF
Wafer thickness: 0.4 – 1.5 mm
Etch rate: GaAs ≥ 10 nm/min
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ALCATEL / ADIXEN / PFEIFFER ATP 150 Load lock turbo pump
PC
Gas cabinet
Control system
Chiller
Gases:
Cl₂, 100 sccm
BCl₃, 100 sccm
CH₄, 50 sccm
Ar, 100 sccm
NH₃, 100 sccm
CHF₃, 200 sccm
N₂O, 200 sccm
2013 vintage.
OXFORD Plasmalab 133 is a reliable and efficient etcher/asher that is useful for processes such as thermal and physical etching or ashing of metals, semiconductors, compounds and hybrids. This equipment has a batch size of up to eight wafers and can be used for substrates up to 200 mm in diameter. Plasmalab 133 features a chamber design which provides excellent uniformity and repeatability of process results, and has a gas atmosphere control system which ensures clean and reproducible wafer processing. OXFORD Plasmalab 133 features a 1400 W RF generator and provides etching capabilities from 0.1 to 25 microns in thickness. The unit is equipped with a mass flow controller, allowing for precise controlled applications of gases and also for external recirculation of process gases. The control of vacuum and pressure is done through the integrated vacuum and pressure control machine, which can be maintained within an accuracy of ±1 mBar. The etching is controlled by the tool software, which has built-in and user-defined recipes and can store up to 50 user-defined recipes. Plasmalab 133 also has an integrated chiller/gas preheater module which is used to regulate the temperature of the etching gases and also control the inlet gas temperature to the etching chamber. The chiller/heater can be pre-set to any desired temperature and is compatible with a wide variety of process gases. The asset also features an adjustable substrate holder which can accommodate a wide range of wafer sizes. The substrate holder is designed to ensure the wafers are held in the optimal position for etching. In addition, OXFORD Plasmalab 133 features an integrated recirculating filtration model which facilitates recycling and recirculation of process gases and evacuates the process residue. This equipment also features an RF plasma monitor as well as a quartz window for viewing the etching process. For maintenance and cleaning, the system is equipped with an oxygen cleaning unit and a hygienic filter to ensure a clean environment within the etching chamber. In conclusion, Plasmalab 133 is a reliable and efficient etcher/asher which can be used for a wide range of applications. The machine is easy to use and can provide excellent process repeatability and uniformity. Additionally, its safe operations are ensured through the integrated safety systems such as the RF plasma monitor, RF generator, and pressure and vacuum control systems.
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