Used STS / CPX MESC Multiplex #9308839 for sale

ID: 9308839
Wafer Size: 4"-6"
Vintage: 1998
ICP Etcher, 4"-6" Wafer material: Si / Glass / QUARTZ Process film: Silicon, poly-Si Process gases: SF6, O2 Etch rate: 1 ~ 5 µm Transfer gate width: 3 ~ 5 cm (2) Dry pumps missing Power supply: 220 V, 60 Hz, 3-Phase 1998 vintage.
STS / CPX MESC Multiplex is a powerful etcher and asher used for etching and ashing a wide range of materials in the manufacture of a variety of electronic, semiconductor, and medical devices. It utilizes advanced multi-stage etching and ashing processes which drastically reduce process time and improve the quality of the finished product. STS MESC Multiplex boasts fast and accurate etching and ashing of materials such as gold, copper, aluminum, tungsten, silicon, lead, and many others. It utilizes a patented multi-stage technique which first etches a given material and then rapidly ashes the etched material without leaving any residue or undesirable traces. This ensures that all materials are etched and ashed to a precise, consistent, and uniform depth within a extremely short cycle time. CPX MESC Multiplex is equipped with features that offer precise control of the chemical composition of the etching and ashing processes. The requested chemical composition of the reaction is determined and added to the reaction chamber prior to commencing the etching or ashing cycle. This ensures that each process is precisely tuned to each individual material. MESC Multiplex is designed and constructed to adapt to various production needs. It can accommodate standard-sized wafers and up to 4" (smaller wafers) concurrently for large-scale production. Furthermore, STS / CPX MESC Multiplex is equipped with multiple advanced accessories such as clamping systems, cartridge fountain, wet coolant control, and microwave attenuator to further improve the quality and consistency of the process. STS MESC Multiplex is also equipped with user-friendly HMI (Human Machine Interface) that monitors and controls the entire etching and ashing process. The graphical interface displays the etching and ashing profiles of each individual stage of the process and allows operators to quickly and accurately make process adjustments during the cycle. Overall, CPX MESC Multiplex is an extremely powerful and efficient etching and ashing machine for a wide range of applications. This advanced, multi-stage etching and ashing processes provide unmatched control and precision in combination with the fast cycle times to dramatically reduce process times and deliver superior quality finished products.
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