Used STS / CPX Multiplex #9145738 for sale

STS / CPX Multiplex
Manufacturer
STS / CPX
Model
Multiplex
ID: 9145738
Wafer Size: 6"
Vintage: 2003
High rate deep silicon ICP etcher, 6" Multiplex atmospheric cassette system (MACS) Advanced silicon etch (ASE) with bosch process HR Chamber for high rate etch Capable : 100mm-200mm MACs Loader for cassette to cassette operation (2 load stations) Load lock pump : iQDP80 Chamber pump : iQDP40-QMB250 Chiller : Tektemp TKD200/5118TL 2μm Trench width etched to 20μm deep >3.5μm Photoresist mask thickness 20μm Deep si etch. Uniformity across a wafer : <±5% Uniformity wafer to wafer : <±5% Selectivity (Si:PR) : >50:1 Selectivity (Si:OX) : >100:1 Average Si etch rate : >3μm/min Profile : 90o±1o Undercut : <0.4μm Per edge 50um Trench width etched to 400um deep >8μm Mask thickness >400μm Deep Si etch to wafer back-side etch stop Uniformity across a wafer: <±5% Uniformity wafer to wafer : <±5% Selectivity (Si:PR) : >40:1 Selectivity (Si:OX) : >80:1 Average Si etch rate : >2.5μm/min Profile : 91o±1o 2003 vintage.
STS / CPX Multiplex is an etcher / asher equipment that has been engineered to support the latest technologies in etching and ashing processes in the print, foil and die industry. This system features two station modular expandability, enabling customers to configure the unit to meet their specific process requirements. The machine features the integrated ACINETIX®, which has been developed to simplify the controller setup and streamline etching and ashing operation. The user-friendly graphical interface allows customers to configure process parameters, monitor tool performance and view graphical status and data trends. The ACINETIX® also provides a range of other features such as registered tracking, automated alarm management and fast prototyping capabilities. STS Multiplex has been designed for high speed and accuracy, resulting in improved yields and less rejects. It features dual-head aspiration and independent process control, enabling users to customise and program etching and ashing cycles with precise detail. This is supported by a high-resolution, enclosed X/Y table which provides users with the ability to precisely position the component for etching and ashing processes. CPX Multiplex has been built to maximize efficiency and reduce downtime. It is fitted with an operation specific wet bench, chemicals module and asset ventilation, allowing users to operate safely and in compliance with local environmental regulations. The model also features an integrated closed-loop cleaning module which helps reduce cleaning times, improves product quality and eliminates the need for manual cleaning. Multiplex is compatible with a range of etching and ashing chemicals, therefore helping customers reduce their operational and supply costs. All major component parts are also easily interchangeable, enabling customers to quickly and cost effectively repair and maintain the equipment. Additionally, users have the ability to integrate this system with other automation equipment, helping customers reduce unit complexity and save time and energy. Overall, STS / CPX Multiplex is a reliable and efficient machine capable of meeting a range of process requirements. It is ideal for etching and ashing processes in the print, foil and die industry.
There are no reviews yet