Used TEGAL 901e #33637 for sale

TEGAL 901e is an advanced etching and ashing equipment that provides robust and reliable etching performance for dry etching applications. It is suitable for a wide range of materials, including gallium arsenide (GaAs), SiGaAs, SiGaSb, and Indium Phosphide (InP). The system comprises a vacuum plasma etching chamber, a high-current plasma source, and a fully-automated robotic transfer arm - all integrated into one package. TEGAL 901 E is designed to deliver ultra-precise etch depth and uniformity with excellent mask physical integrity and makes use of a gas-balanced etching process that ensures superior perpendicularity of the etched surfaces. Additionally, the unit is capable of making micron-precision demarcation lines that are essential for fabrication of photoelectronic devices. The vacuum chamber of 901e features an inductively-coupled plasma source that greatly reduces processing time, while delivering a high processing rate and reliable substrate result. 901 E is equipped with an active pressure and temperature control machine that allows the user to simultaneously control etch plasma and ambient temperature. It also features a plasma monitor, which can be used to accurately measure both etch rates and temperatures. TEGAL 901e's robotic transfer arm provides fully automated substrate loading and transfer, and features an integrated anti-collision tool and safety handler. The arm's base conforms to the industry-standard EPROM/EEPROM socket, which allows easy and secure substrate loading and unloading. In addition, TEGAL 901 E supports numerous process conditions, including etch gases and pressure settings, making it an ideal solution for both production and R&D applications. Moreover, it is compatible with a variety of popular etch processes, such as reactive ion etching (RIE), deep reactive ion etching (DRIE), plasma enhanced etching (PEE), and plasma etching (PE). All in all, 901e is a high-performance etching and ashing asset capable of delivering superior etching and uniformity, along with excellent mask physical integrity. It is suitable for many dry etching applications and is an invaluable tool for both production and R&D activities.