Used TEGAL 901e #9290041 for sale

TEGAL 901e is an etching / ashing equipment designed for the High Density Plasma Gated etching and ashing of semiconductor, MEMS, and compound device fabrication. The system offers high etch rates and uniformity with extremely low defectivity and high selectivity to photoresist. It is designed to provide precision etch depth control, fast and repeatable etch rates, and low damage through rapid ramp and soak processes. TEGAL 901 E unit offers improved surface planarization with a variety of etch chemistries, including reactive isotropic etching, metal etching (including copper etch), and Insulator etching, and a variety of etch chemistries. Its unique design features include a high density endpointing module, dual wafer loading, and a high-powered quartz zone-source load-lock option. The machine also offers advanced optical endpoint detection, automated wafer exchange capabilities, and drift compensation. 901e utilizes electromagnetically-induced Plasmasources and high density plasma-assisted etching. This includes Electron Cyclotron Resonance (ECR) and inductively-coupled plasma (ICP) configurations, both of which offer high etch rates, low substrate damage, and high controllability over etch depth. The plasma sources have low pressure and high density, with a range of RF power from 10 to 150 W and operating frequencies of 95 kHz to 13.56 MHz. 901 E offers multiple etch chemistries with full control of gas flow rate, pressure, and delivery, as well as wafer residence time. For predefined recipes, it has the ability to register each etch step for uniformity and reproducibility. The tool also supports automated processing and endpoint detection with advanced optical and infrared endpoint detection systems, allowing for efficient and reliable processing. The asset has a highly integrated design and efficient material handling solutions, allowing for easy handling of wafers. It is also capable of managing up to three reactor chambers at the same time, and its advanced safety features include a lid interlock model, purge circuit, and matchstick detector. Its user-friendly graphical user interface makes it easy to use and allows for improved control and monitoring of etching and ashing processes. Overall, TEGAL 901e offers a reliable and cost-effective solution for semiconductor etching and ashing processes. Its advanced etch chemistries, high etch rates, consistent uniformity, low defectivity, and high selectivity to photoresist make it an ideal choice for applications in microelectronics and MEMS fabrication.