Used TEGAL 981 #9267872 for sale

TEGAL 981
Manufacturer
TEGAL
Model
981
ID: 9267872
Wafer Size: 8"
Silicon nitride etcher, 8" Single chamber.
TEGAL 981 is an etcher / asher used extensively in the semiconductor and microelectronic industries for a variety of applications. 981 is a full-featured advanced etching/ashing apparatus. It features an automated three-level process for etching and ashing, and it is capable of multiple wafer sizes up to 200 mm. The equipment's temperature range is 25°C to 200°C, and the chamber is capable of an etching/ashing time of 0-99 seconds. The system also features a dry-etch capability and an optional vapor deposition process. TEGAL 981 employs an advanced plasma etching process, with the flexibility to use a variety of gases. It supports Cl₂, CO₂, CF₄, O₂, and H₂, with a pressure range of 10 mtorr to 500 mtorr. This provides even etching of the most difficult materials, including polysilicon, GaAs and nitrides, and with outstanding repeatability. The unit design also includes a temperature controller, Vacuum Density Controller (VADC), flame detector, and an EtherNet-based machine controller. The temperature controller monitors and adjusts the temperature and maintains the stability of the chamber. The VADC provides precise control of the chamber's flow rate, ensuring a consistent etching rate. The flame detector prevents any unwanted ignition within the chamber, and the EtherNet-based tool controller and user interface simplify operating, monitoring, and diagnostics. The chamber features an Ultimate Load Lock (ULL) asset, with separate load and unload doors. This model eliminates internal contamination and ensures wafer cleanliness and reproducible compositional qualities between batches. The pressure control is highly accurate and repeatable, with a pressure range of 1 mtorr to 700 mtorr. This allows the accurate control of etching rates and high quality etching results. 981 is the perfect solution for etching and ashing precision components. Its advanced features, including advanced plasma etching, precise pressure and temperature control, and high throughput, make it an ideal solution for a broad range of applications.
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