Used TEL / TOKYO ELECTRON Unity IIe 855DS #293820513 for sale
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ID: 293820513
Wafer Size: 8"
Oxide etcher, 8"
(26) Slots
SCCM DHhard Chambers
Process: C5F8, Ar, O2, CHF3, CF4
Voltage: 3φ200VAC 325A
Frequency: 50Hz
Load lock chamber
(2) Cassettes
SMIF
RF generator
(2) Chambers
(2) Turbo EDWARDS STP-A1303W1 pumps
ESC, 8"
KASHIYAMA RD300 Transport chamber pump
(3) KASHIYAMA SDE90 Pumps.
TEL / TOKYO ELECTRON Unity IIe 855DS is an advanced etcher/asher designed for high-precision wafer processing. The equipment combines advanced TEL UV-6700 dynamic uniformity control (DUC) with a state-of-the-art optics package to provide superior process results. The system is built around an advanced Silicon on insulator (SOI) substrate holder. The substrate holder can accommodate both standard silicon wafers as well as novel substrates such as Large Area Glass Substrate (LAGS) and alternative SOI structures. The holder is equipped with vacuum feedthroughs, enabling the precise feeding of etch gases to the surface of the wafer during the etching process. The unit also features TOKYO ELECTRON new advanced PC-TDC (PC-Based Tuning and Diagnostics Control) technology. This machine allows for real-time monitoring and tuning of the etch parameters such as gas delivery, pressure, etch duration, temperature, and vacuum. It provides a comprehensive view of the entire etch process and its parameters, enabling precise fine-tuning and rapid optimization. TEL Unity IIe 855DS utilizes a high-performance optical package that allows for accurate analysis of the wafer's profile and topography. The advanced optics package can detect minute features on the wafer and provides data for further post-processing. In addition, the tool is equipped with an advanced wafer alignment and tracking asset. This model is capable of precisely aligning and tracking non-standard substrates and resists, and allows for fine-tuning of etch parameters to achieve desired process results. TOKYO ELECTRON Unity IIe 855DS is a fully automated etcher/asher equipment capable of high-precision performance. It provides users with an advanced platform to effectively and precisely process a variety of wafer substrates. With its combination of advanced UV-6700 DUC technology, intuitive PC-TDC system, and broad optics package, Unity IIe 855DS provides state-of-the-art etching and ashing performance.
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