Used ULVAC CS-300R #293607110 for sale
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ID: 293607110
Wafer Size: 2"-6"
ICP Reactive Ion Etcher (RIE), 2"-6"
Gases: ITO, Ti, GaN, PR, SiO2
PC Non-functional.
ULVAC CS-300R is an etching/ashing equipment designed to quickly, precisely and cleanly process various materials such as silicon and metals. It is ideal for fabrication of MEMs (Micro-electro-mechanical systems) in fields such as the semiconductor industry, and automotive, consumer appliances and power supplies. The machine consists of a process chamber, a vacuum chamber, and a cooling unit of the exhaust gas processor. The process chamber of CS-300R is constructed from stainless steel, ensuring that the high performance etching and ashing processes are performed cleanly and accurately. The chamber is designed to be easily and quickly purged, maintained and replaced, making it ideal for repeatable, reliable processes. ULVAC CS-300R vacuum system uses a two-stage pumping unit to achieve up to 2.25 x 10-3 Pa pressure inside the chamber, allowing for precise, uniform etching and ashing processes even with a larger-scaled substrate. This machine also enables faster pumping down times and higher process purity. CS-300R has the capability of processing in a wide range of parameters including temperature range, flow rate, and pressure. This flexibility allows it to handle a variety of etching and ashing tasks. Also, with the advanced hydrodynamic etching technique, the machine can effectively reduce the etching period and minimize waste. In addition to these features, ULVAC CS-300R is integrated with advanced safety features, such as alarms and automatic shutdowns, to ensure the process proceeds safely. Moreover, the tool is equipped with a built-in recipe management asset which helps the user to easily create, store, and modify recipes for repeatable, precise etching and ashing processes. Overall, CS-300R provides etching and ashing solutions that meet precise manufacturing requirements. With its flexibility and control, it can handle a wide range of materials with precise temperatures, pressures, and times to achieve precise etching and ashing results. It is ideally suited for use in the semiconductor, automotive, consumer appliance, and power supply industries.
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