Used ULVAC Enviro II #293757415 for sale

ULVAC Enviro II is an etcher/asher equipment designed for use in semiconductor and microelectronics fabrication. It is specifically designed to etch and/or remove thin films, as well as for post-metal etching. Enviro II utilizes vacuum technology to facilitate horizontal ashing and etching processes. ULVAC Enviro II has a chamber structure consisting of a main chamber and a processing chamber. Both the main chamber and the processing chamber are sealed with a double O-ring. The main chamber is equipped with a loadlock system for easy handling of substrates and has a large door for easy load and unload of substrates. The processing chamber is equipped with a chuck table that securely holds the substrate during processing. Enviro II is also equipped with a cryogenic cooling unit that enables accurate and precise temperature control. Two liquid nitrogen reservoirs inside the chamber facilitate even cooling of the substrate during the etching process. The cooling machine is adjustable and the temperature of the liquid nitrogen is easily adjustable. This allows users to maximize etching results. The tool features a wide range of exciting features designed to minimize cross dimensional etching errors and improve etching accuracy. ULVAC Enviro II utilizes a Mass Flow Meter asset to accurately measure and control gas flow, pressure, and temperature for precise and uniform etching. It also has an Oscillator Gas Focusing model that allows users to change the plasma current from 0-25mV and the etching width from 10-50um. This provides greater process control and increases substrate throughput. Furthermore, Enviro II has an Anti-Bumping Plate that reduces the generation of particles due to plasma erosion. The equipment also features a Multi-Wafer Cassette Adapter that allows users to process up to 8 wafers simultaneously. This helps to reduce processing time, increase throughput, and improve process stability. ULVAC Enviro II is compatible with a wide range of process gases and has a maximum etching rate of up to 8μm/min. Overall, Enviro II is a reliable and flexible etcher/asher system capable of achieving high-resolution etchings. The unit's precise temperature control, precise gas flow control, and its wide range of exciting features enable users to achieve optimal results.