Used ULVAC Enviro III #9014614 for sale

ULVAC Enviro III is an advanced etcher / asher equipment designed for high-efficiency deep reactive ion etching (DRIE) applications. It utilizes a combination of RF and DC Ion Source Technology, which allows for the machining of substrates at rates up to 8nm/min. This etcher features an exposed wafer carrier system, allowing the operator to load substrates onto the quartz platen without any external gas or vacuum supply. Enviro III also features an integrated controller and user interface for easy and precise unit operation. The machine can etch multiple material types and combines advanced DRIE features, such as "triggered" control that provides the highest level of process consistency. ULVAC Enviro III also has a pressure monitor to allow the operator to ensure a uniform process atmosphere with minimal oxygen pickup and process variation. Enviro III is designed for high-throughput specialized DRIE etching applications. It can be used for creating polymer etch resistant masks, making side wall contact hole etching, deep etching of narrow and deep micro channels, deep trenching, and other advanced wafer micro machining operations. ULVAC Enviro III is equipped with advanced safety features such as pressure and vacuum interlocks, and is designed to provide maximum reliability, repeatability, and low maintenance costs. It features an integrated automatic cleaning/purging tool to keep the asset available for longer periods of time without frequent maintenance. Enviro III is made to be a robust and reliable etching solution that can process substrates up to 8-inches in diameter, and has a maximum wafer load of twelve. This model can be used in a wide variety of etching applications, including MEMS, high end semiconductor fabrication, MEMS sensors, MEMS actuators, and many more. ULVAC Enviro III etcher combines advanced manufacturing capabilities, ease of use, efficient operation, and minimal maintenance for superior performance on a wide variety of etching applications. The equipment can consistently etch substrates at up to 8nm/min, and its advanced features and design make it a reliable, high performance etching solution for a variety of specialized applications.