Used ULVAC FRE-200E #9244585 for sale

ULVAC FRE-200E is a reactive ion etching (RIE) tool used for etching a variety of substrates based on a range of materials with high selectivity and accuracy. The unit is capable of processing substrates up to 200mm in diameter. With the help of its advanced high frequency power supply, FRE-200E can handle etching at a wider range of processing temperatures, between 0 and 200°C. Additionally, its configurable equipment makes it possible to process a variety of semiconductor substrates and critical pattern shapes, including LIGA, multilayer stacks, thin film processes, MEMS, advanced packaging and panels. ULVAC FRE-200E also offers confidence for the user with process uniformity thanks to the 2D monitor and end point detection support. It is also designed with a wafer rotating mechanism to ensure a uniform ion distribution for precision etching, allowing for smoother processing of complex shapes. Additionally, the feature of a dedicated auxiliary inductance help the designer optimize etch profile and reduce load curvature. The machine has a load lock system for a user-friendly way of subjacent and post- etching deposition. It is also equipped with ULVAC proprietary "Soft Land" technology, a unique landing algorithm which helps avoid contamination and allows for the smooth scheduling and operation of the RF power supply under different substrate conditions. FRE-200E is also designed with the latest safety features such as the lockout/tagout unit, interlock door machine, and water monitoring tool for a secure operation environment. Overall, ULVAC FRE-200E is an etcher/asher tool that combines accuracy, efficiency, and safety to provide reliable etching for even the most complex substrates. Its configurable asset, advanced RF power supply, load lock model for deposition, and ended point detection for process uniformity makes it a valuable tool for both research and the industrial markets.