Used ULVAC NA-8000 #9314090 for sale

ULVAC NA-8000 is an etcher / asher that offers a high level of precision and control during the etching and ashing process. It is widely used for processing wide variety of substrates, including silicon wafers, glass, and metals. This equipment features a dual-chamber design with one dedicated to pre-etching and dry-etching with the other for post-etching and wet-etching, allowing for maximum flexibility and efficiency in the etching and ashing process. The system employs a computer-controlled time and temperature control unit that determines the desired etch depth and rate. This allows for more accurate etching and ashing with fewer over etch issues. The exposure of the substrate to a plasma allows for improved etching and ashing performance. The etch rate and uniformity are increased while the contamination is decreased. ULVAC NA8000 features a loadlock machine for precise wafer handling. This is particularly useful for when processing fragile substrates, as it minimizes damage or out-gassing. The wafers can also be loaded and unloaded from the tool without breaking the vacuum or exposing the asset to contamination from the outside environment. NA 8000 offers a wide range of process parameters for etching and ashing, such as pressure, temperature, and time of exposure. The model also features an automation routine that enables users to set up and manage multiple etching/ashing recipes with different process parameters. This equipment is compatible with formats P-2.5, P-3, and P-4 for quick setup and easy measurement. The NA-800 is equipped with an adjustable stage that can be adjusted up to 800x500 mm. This built-in stage allows users to quickly and effectively mask the area that is not going to be etched. The system also features a direct plasma generator and an in-built Semiconductor Grade Gas Delivery Unit. These features automate the etching/ashing process and also allow users to control the gas flow and pressure. ULVAC NA 8000 etcher/asher is a compact, precise, and easy to use unit that is very effective for both etching and ashing small and large substrates. It is capable of etching and ashing a wide variety of materials, and it offers the flexibility and convenience of a dual-chamber machine with an automated process routine. The adjustable stage and direct plasma generator offer users greater control and precision during the etching and ashing process. The tool is also compatible with multiple formats, making it an ideal solution for semiconductor processing.