Used ULVAC NE 550 #293758401 for sale

ULVAC NE 550 is an etching/etching-ashing machine manufactured by ULVAC Technologies, Inc. NE 550 is designed to reduce the amount of time needed to etch or ash wafers by utilizing a "dry process" technology. This technology accelerates the etching/ashing process by using a combination of a holding table, plasma flow, and nitrogen gas. ULVAC NE 550 is equipped with a computer control equipment and a textured TABLE, which enhances the adhesion of the etch-ash on the wafer's surface. This table also provides excellent wafer flatness. The chamber size on NE 550 is 40 cm (length) x 36 cm (width) x 25 cm (height). This allows for wafers up to 400 mm in diameter and thick films up to 1 mm. ULVAC NE 550 is also equipped with a redo and auto-align feature, enabling the system to quickly align the wafer prior to etching. NE 550 utilizes two plasma sources, inductively coupled and electron-cyclotron resonance (ECR), with a power range of 10 to 3,000 watts for precise etching/ashing. The temperature range is between 100°C and 450°C, and the etch rate is 0.3 μm/min to 15 μm/min. ULVAC NE 550 has an automated control unit with programmable recipes and parameters, enabling user-friendly operation. The machine also features an advanced reactive gas tool that combines the use of oxygen, nitrogen, HCl, CF4 and SF6 gases for etching and ashing applications. NE 550 is ideal for etching/ashing metals and dielectric layers on silicon wafers. It is also used in various industries for processing semiconductor devices, solar cells, and flat panel displays. It is widely used in research and development applications. ULVAC NE 550 is an effective asset that has proven to be an efficient and reliable solution for any etch/ash application. Its combination of precision, speed, and accuracy makes it an ideal choice for fabricating sophisticated components. It is a great option for users requiring advanced etching and ashing tools to produce reliable and precise results.