Used ULVAC NE 550C #9266611 for sale

ULVAC NE 550C
Manufacturer
ULVAC
Model
NE 550C
ID: 9266611
Wafer Size: 6"
Vintage: 2006
Dry etching system, 6" Gas: CF4, O2, Ar, N2, He 2006 vintage.
ULVAC NE 550C is an etcher and asher intended for the size reduction and definition of patterns on wafers with an upper limit of 8" in diameter. ULVAC NE-550C's advanced design and features allow for superior production performance and precision. ULVAC proprietary condensation assisted reactive etching technology produces high quality results with low side etching entrance. The machine uses an in-line, high-performance RF generator with integrated pulse-etching capabilities. The pulse-etching ensure high, uniform definition of patterns on the wafers and limit any unnecessary etching. NE 550C features the ability to switch between etching and ashing processes, making it useful in a wide range of applications. This feature is ideal for customers who need to switch between processes frequently, allowing for greater efficiency and productivity. The machine also features automatic wafer handling that starts the etching or ashing process as soon as the wafer has been placed inside the chamber. The fully automated controlling equipment, PC based controller, enables users to adjust etching processes to meet the highest standard required. The user friendly software and intuitive user interface provide complete control over parameters such as gas composition, pressure, etch time, and temperature. NE-550C contains an onboard vacuum system that provides high uniformity of plasma in the process chamber while minimizing the influence of external gas and air. An automatic gas filter cleaning unit and automatic leakage detection machine help to reduce downtime due to gas line maintenance and ensure safe processing. ULVAC NE 550C is a highly efficient etching and ashing machine ideal for wafer processing applications. It's advanced technology allows for high quality processing with low side etching entrance. The ability to switch between processes, automatic wafer handling, onboard vacuum tool, and intuitive user interface ensure efficient and safe processing, making it ideal for even the most demanding applications.
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