Used ULVAC NE-950EXk #9204281 for sale

ULVAC NE-950EXk Etcher/Asher is a high-precision etching and ashing equipment capable of producing high-quality etching and ashing processes. Using its high-precision pressure control system and ULVAC unique etching technology, NE-950EXk can produce films with very uniform etch depths and narrow linewidths. ULVAC NE-950EXk is an etcher/asher that uses a series of chemical processes and physical techniques to etch or ashen materials. The unit includes a plasma etcher module for depositing etching masks and a sputtering module for removing etch masks. The machine also has an integrated high-precision pressure control tool that can be used for precise etching and ashing. The etching process is performed using a chemical agent that reacts with the material in the gas phase and is used to precisely etch the film. The ashing process is performed with an oxidizer that is used to etch away unwanted material from surfaces. This process permits precise ashing with no residual layer and greater accuracy than can be achieved with other methods. NE-950EXk asset is also equipped with three independently-controllable gas sources, temperature sensors, and a mass-flow controller to enable precise etching and ashing. Additionally, the model also has a chamber pressure monitoring equipment that allows for precise and repeatable vacuum results. In addition to etching and ashing, ULVAC NE-950EXk can also produce albums ions, sputter-deposited films, and polymers films. Furthermore, the versatile system allows for multi-layer substrate processing. In summary, NE-950EXk is a high-precision etching and ashing unit capable of producing high-quality results with wide etch depths and narrow linewidths. The machine's integrated high-precision pressure control tool and unique etching technology also make it a great solution for producing films with precise and repeatable etch depths and narrow linewidths. Finally, the asset's versatility allows it to also produce sputter-deposited films, ion beam deposition, and multiple layers of substrates.