Used ULVAC NE-950EXk #9410744 for sale

Manufacturer
ULVAC
Model
NE-950EXk
ID: 9410744
Dry etcher Power supply: AX 3000 III Antenna and bias Matching box: AMVG-2000-GA Antenna AMVG-1000-125M-FV Bias ULVAC HR60 Dry pump TMP: 2203LMTG(UI) NUTEK MFC FCST1005LUC-4J2-F1000-N2 Gases: Gas line / Flow Ar / 100 SCCM D2 / 100 SCCM CF4 / 400 SCCM SF6 / 200 SCCM CL2 / 200 SCCM BCL3 / 200 SCCM BCL3 / 50 SCCM N2 / Gas line purge TPR280 Prirani gauge IKR251 Cold cathode gauge FSTC-CS003L-EC Chiller 65048-JHHC-AEX1 Vacuum throttle valve 649A21T21CAVR PFC Unit He cooling HITACHI RS550 UPS power supply.
ULVAC NE-950EXk is an etcher/asser with a high-vacuum chamber capable of plasma processing in an area 200mm x 200mm. It creates a plasma process of hydrogen or oxygen with high accuracy for precise etching/etching or surface activation. NE-950EXk is equipped with a power generating source, a process gas mixing source, a pumping source, a temperature controlling source and a temperature monitoring source. ULVAC NE-950EXk is also equipped with a low-temperature vacuum pump, which makes it ideal for etching and surface modification of organic substrates. Its plasma processing system offers an effective depth of approximately 10um, allowing for precise control of the thin film surface. NE-950EXk also offers a wide range of process parameters for etching and surface treatment, such as the time and current for etching, the temperature for surface activation, and gas flow rate. In addition, ULVAC NE-950EXk can be operated in a manual or semi-automated mode. The manual mode allows for basic control of the parameters, while the semi-automated mode allows for setting customized process parameters and automatic compensation for irregularly shaped substrates. The driver also offers data storage and software update capabilities, further providing ease-of-use when performing etching and surface treatment. Furthermore, a 1000-point vector generator is included to allow for setting up of the etching process, while simultaneous cooling can be used to ensure the best possible substrate quality. NE-950EXk's high-vacuum chamber also ensures that the etching/surface treatment processes are conducted in a clean environment. Overall, ULVAC NE-950EXk is an etcher/asser that provides precise etching/surface activation on multiple substrates with a wide range of process parameters. It has a high-vacuum chamber for a clean processing environment and can be operated in both manual and semi-automated modes. Moreover, vector generators provide additional accuracy, while cooling systems help maintain the best quality substrates during etching.
There are no reviews yet