Used ULVAC NE-950EXz #293797486 for sale

ULVAC NE-950EXz is a state-of-the-art etcher/asher equipment designed for the precise and high-performance processing of various materials in the semiconductor, MEMS (Micro-Electro-Mechanical Systems), and other related industries. This system incorporates advanced technologies and features that enable efficient and uniform processing of substrates with superior etching and ashing results. One of the key highlights of NE-950EXz is its versatile processing capabilities, which enable a wide range of applications including photoresist removal, surface cleaning, etching of dielectric and metallic materials, and other critical processes in semiconductor fabrication and research. This flexibility is achieved through a combination of innovative hardware design, sophisticated process control algorithms, and user-friendly software interfaces that facilitate easy customization of process parameters for different applications. The unit features a dual-frequency, inductively coupled plasma (ICP) source, which generates a highly reactive plasma with excellent ion density and energy distribution for efficient material removal and etching. The ICP source is complemented by a downstream plasma source for additional control over the process chemistry and plasma properties, enabling enhanced etch selectivity, uniformity, and repeatability. Moreover, ULVAC NE-950EXz is equipped with a robust reactive ion etching (RIE) chamber with precise temperature control and gas flow management capabilities. This chamber is designed to accommodate various substrate sizes and types, from wafers to individual samples, ensuring compatibility with different process requirements. The machine also features advanced endpoint detection capabilities, which allow real-time monitoring of the etching process and accurate determination of endpoint signals for improved process control and reproducibility. In addition to its etching capabilities, NE-950EXz is also capable of performing ashing processes for the removal of organic contaminants, photoresists, and other residues from substrate surfaces. The tool's ashing chamber is equipped with dedicated gas flow control systems and temperature management features to ensure optimal ashing conditions and minimize damage to sensitive materials during the process. Furthermore, ULVAC NE-950EXz is designed with a high degree of automation and reliability to facilitate efficient, hands-free operation and minimize downtime. The asset includes advanced diagnostic tools, remote monitoring capabilities, and automated maintenance routines that help to optimize model performance, extend component lifetimes, and reduce operational costs for users. Overall, NE-950EXz represents a cutting-edge solution for etching and ashing applications in advanced semiconductor manufacturing, research, and development. Its combination of high-performance plasma sources, versatile process capabilities, precise control features, and advanced automation functionalities make it a valuable tool for achieving superior process results, enhancing productivity, and advancing the development of next-generation semiconductor devices and technologies.